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2U3823-25QDBVRG4Q1

Texas Instruments

2U3823-25QDBVRG4Q1 by Texas Instruments

2U3823-25QDBVRG4Q1 by Texas Instruments is a Power Management IC with 5 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.1-5.5 V and is AEC-Q100 compliant for automotive applications. The package style is small outline, low profile, with shrink pitch, suitable for power supply management circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,423 parts In-Stock

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6,423

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Digiode

USA . 338 parts In-Stock

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338

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Distributors (Availability)

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One Stop Electronics

USA . 850 parts In-Stock

1+ parts

$1.500

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-

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850

$1.500

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Parana Technologies

USA . 2,134 parts In-Stock

1+ parts

$1.560

100+ parts

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$2.205

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2,134

$1.560

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$2.205

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IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$1.753

100+ parts

-

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$1.578

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741

$1.753

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$1.578

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ChromeModa Solutions

Germany . 700 parts In-Stock

1+ parts

$1.753

100+ parts

$1.437

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700

$1.753

$1.437

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Ampacity Inc.

Singapore . 1,649 parts In-Stock

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$2.500

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1,649

$2.500

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Semicontronic

India . 369 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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369

$3.500

$3.412

$3.395

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AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$8.159

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709

$8.159

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Native Components

USA . 993 parts In-Stock

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$23.340

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993

$23.340

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Northwest PG Solutions

USA . 204 parts In-Stock

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$25.674

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$23.107

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204

$25.674

$23.107

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Corphita

USA . 3,075 parts In-Stock

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3,075

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DigiPath Technology Company

USA . 732 parts In-Stock

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$1.581

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$1.581

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Microchip USA

USA . 315 parts In-Stock

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Corohmni

South Africa . 189 parts In-Stock

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Overview

Power up your automotive applications with the 2U3823-25QDBVRG4Q1 by Texas Instruments! Manufactured by a trusted industry leader, this power management IC offers top-notch quality and reliability. Ideal for a wide range of applications, this compact and versatile device provides a nominal supply voltage of 2.5V and operates in temperatures ranging from -40°C to 125°C. With its small outline, low profile package style and dual terminal position, this IC is a must-have for automotive electronics. Experience superior performance and efficiency with the 2U3823-25QDBVRG4Q1 - invest in quality, invest in success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal and mechanical properties, making the package durable and reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the Power Management IC meets automotive industry standards for reliability, making it suitable for automotive applications.

Nominal Supply Voltage (Vsup): 2.5 V

2.5V nominal supply voltage provides a stable power source for the IC, ensuring consistent performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the IC to withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates that the Power Management IC can operate in high temperature environments commonly found in automotive systems, ensuring reliable performance.

Technical Specifications

Power Management ICs 2U3823-25QDBVRG4Q1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.25V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

2U3823-25QDBVRG4Q1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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