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2U3823-50QDBVRG4Q1

Texas Instruments

2U3823-50QDBVRG4Q1 by Texas Instruments

2U3823-50QDBVRG4Q1 by Texas Instruments is a Power Management IC with 5V nominal voltage, AEC-Q100 screening level, and -40 to 125 °C operating temperature range. Ideal for automotive applications due to its small outline package style and dual terminal position.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,700 parts In-Stock

1+ parts

-

100+ parts

$1.140

1k+ parts

$0.946

10k+ parts

$0.844

5,700

-

$1.140

$0.946

$0.844

DigiKey

USA . 5,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.970

10k+ parts

-

5,700

-

-

$0.970

-

Verical

USA . 5,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.183

10k+ parts

$1.054

5,700

-

-

$1.183

$1.054

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,504 parts In-Stock

1+ parts

$0.885

100+ parts

-

1k+ parts

-

10k+ parts

-

3,504

$0.885

-

-

-

Vyrian

USA . 3,928 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

-

10k+ parts

-

3,928

$0.932

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,572 parts In-Stock

1+ parts

$0.790

100+ parts

$0.770

1k+ parts

$0.766

10k+ parts

-

5,572

$0.790

$0.770

$0.766

-

Ampacity Inc.

Singapore . 5,554 parts In-Stock

1+ parts

$0.790

100+ parts

-

1k+ parts

-

10k+ parts

-

5,554

$0.790

-

-

-

Corphita

USA . 4,909 parts In-Stock

1+ parts

$0.839

100+ parts

-

1k+ parts

-

10k+ parts

-

4,909

$0.839

-

-

-

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$0.932

-

-

-

Native Components

USA . 165 parts In-Stock

1+ parts

$2.093

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$2.093

-

-

-

Northwest PG Solutions

USA . 525 parts In-Stock

1+ parts

$2.303

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$2.303

-

-

-

Parana Technologies

USA . 1,165 parts In-Stock

1+ parts

$3.550

100+ parts

-

1k+ parts

$4.072

10k+ parts

-

1,165

$3.550

-

$4.072

-

ChromeModa Solutions

Germany . 2,078 parts In-Stock

1+ parts

$3.989

100+ parts

$3.271

1k+ parts

-

10k+ parts

-

2,078

$3.989

$3.271

-

-

IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$3.989

100+ parts

-

1k+ parts

$3.590

10k+ parts

-

961

$3.989

-

$3.590

-

Perfect Parts

USA . 6,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,019

-

-

-

-

Glotronic Ltd.

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 465 parts In-Stock

1+ parts

-

100+ parts

$3.596

1k+ parts

-

10k+ parts

-

465

-

$3.596

-

-

Microchip USA

USA . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

228

-

-

-

-

Overview

Elevate your power management game with the 2U3823-50QDBVRG4Q1 by Texas Instruments. Crafted with precision and expertise, this Power Management IC is designed to meet the highest standards of quality and reliability. From its durable plastic/epoxy body to its automotive-grade temperature grade, this IC is built to excel in a variety of applications. With a wide supply voltage range and low profile package style, this product offers unmatched versatility and performance. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the 2U3823-50QDBVRG4Q1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature makes it easy to integrate this Power Management IC into circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the IC meets automotive industry standards for reliability and quality, making it suitable for use in automotive electronics.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on circuit boards and enables a compact design for tight spaces.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V provides stable power to the IC, ensuring reliable performance in various applications.

Power Supplies (V): 1.1/5.5

Support for a wide range of power supply voltages (1.1V to 5.5V) makes this IC versatile and compatible with different power sources.

No. of Terminals: 5

Having 5 terminals allows for easy connection to external circuitry, simplifying the design and integration process.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style saves space on the PCB and enhances the overall compactness of the design.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this IC can withstand high-temperature conditions, making it suitable for automotive applications where heat dissipation is critical.

Technical Specifications

Power Management ICs 2U3823-50QDBVRG4Q1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

2U3823-50QDBVRG4Q1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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