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2U3824-25QDBVRG4Q1

Texas Instruments

2U3824-25QDBVRG4Q1 by Texas Instruments

2U3824-25QDBVRG4Q1 by Texas Instruments is a Power Management IC with 5 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.1-5.5 V and is AEC-Q100 certified for automotive applications. The package style is small outline, low profile, with shrink pitch, suitable for power supply management circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,401 parts In-Stock

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4,401

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Digiode

USA . 1,600 parts In-Stock

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1,600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 133 parts In-Stock

1+ parts

$1.500

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133

$1.500

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Parana Technologies

USA . 238 parts In-Stock

1+ parts

$6.082

100+ parts

$564.830

1k+ parts

$5.474

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238

$6.082

$564.830

$5.474

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DigiPath Technology Company

USA . 772 parts In-Stock

1+ parts

$6.697

100+ parts

$6.162

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772

$6.697

$6.162

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

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$6.834

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$6.151

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1,533

$6.834

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$6.151

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ChromeModa Solutions

Germany . 1,494 parts In-Stock

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$6.834

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$5.604

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1,494

$6.834

$5.604

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One Stop Electronics

USA . 1,431 parts In-Stock

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$7.500

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$7.500

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Semicontronic

India . 1,239 parts In-Stock

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$7.500

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$7.312

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$7.275

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1,239

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 734 parts In-Stock

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$15.500

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734

$15.500

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Microchip USA

USA . 4,675 parts In-Stock

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4,675

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Native Components

USA . 911 parts In-Stock

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911

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Corohmni

South Africa . 440 parts In-Stock

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440

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Northwest PG Solutions

USA . 430 parts In-Stock

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430

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Corphita

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190

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Overview

Unleash the power of Texas Instruments with the 2U3824-25QDBVRG4Q1 Power Management IC. Designed for automotive applications, this small outline, low profile package offers high quality and reliability. With a wide supply voltage range and dual terminal position, this IC provides optimal performance in varying conditions. Trust Texas Instruments to deliver cutting-edge technology that meets the demands of today's automotive industry. Experience the value and benefits of this top-of-the-line power supply management circuit – upgrade your systems with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat, making this product suitable for automotive applications where the IC may be exposed to harsh conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and making the product suitable for automated manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality of the product, making it ideal for automotive applications where performance under tough conditions is essential.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5V supply voltage provides a stable power source for the IC, ensuring consistent performance and reliability in various operating conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments commonly found in automotive applications, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in a wide range of environments, from extreme cold to high heat.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance of the IC.

Width (mm): 1.6 mm

The small width of 1.6mm allows for compact and space-efficient designs, making this product suitable for applications where board space is limited.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures that this product meets the necessary requirements for operation in automotive applications, guaranteeing reliability under challenging conditions.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection to the circuit board, reducing the risk of solder joint failures and ensuring long-term performance of the IC.

Technical Specifications

Power Management ICs 2U3824-25QDBVRG4Q1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.25V; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/5.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

2U3824-25QDBVRG4Q1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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