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VNQ830MTR-E

STMicroelectronics

VNQ830MTR-E by STMicroelectronics

VNQ830MTR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 4 functions. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for applications requiring reliable power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,560 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,560

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Digiode

USA . 2,531 parts In-Stock

1+ parts

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2,531

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Anansix

USA . 1,368 parts In-Stock

1+ parts

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1,368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$13.239

100+ parts

-

1k+ parts

$11.915

10k+ parts

-

1,478

$13.239

-

$11.915

-

AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$14.920

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$14.920

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Microchip USA

USA . 240 parts In-Stock

1+ parts

$18.818

100+ parts

-

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240

$18.818

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-

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MKK Technologies

India . 842 parts In-Stock

1+ parts

$24.895

100+ parts

-

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842

$24.895

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-

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DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$24.895

100+ parts

-

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10k+ parts

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842

$24.895

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-

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Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

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100+ parts

$15.829

1k+ parts

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1,980

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$15.829

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Corphita

USA . 1,165 parts In-Stock

1+ parts

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1,165

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Elevate your designs with the VNQ830MTR-E from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile peripheral driver combines robust performance with built-in protections against overcurrent, overvoltage, and thermal challenges, ensuring reliability across various applications. With its compact design and advanced technology, it offers seamless integration and optimal efficiency, empowering you to create innovative solutions that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy lends durability and light weight to the product, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability enables compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 36 V

A high maximum supply voltage allows compatibility with a broader range of devices and reduces the need for external voltage regulation.

No. of Functions: 4

Having multiple functions integrated in one device simplifies the design and reduces the overall component count in a circuit.

Package Shape: RECTANGULAR

The rectangular shape allows for effective space utilization on PCBs, promoting efficient design layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and safety, reducing the risk of damage during operation.

Power Supplies (V): 13

Operating at a standard voltage of 13V aligns with many common power supply options, facilitating easier integration.

No. of Terminals: 28

A higher number of terminals provides more options for connections and functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving designs and is ideal for compact electronic products.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage allows the driver to operate in lower voltage environments, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing signal integrity.

Terminal Position: DUAL

Dual terminal position configuration aids in layout flexibility on the PCB, improving assembly efficiency.

Maximum Seated Height: 2.65 mm

A low seated height allows for low-profile designs, attracting applications that require minimal vertical space.

Width: 7.5 mm

Narrow width adds to the space efficiency of the product, making it suitable for compact or dense circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A manageable peak reflow time supports compatibility with standard soldering processes in manufacturing.

Peak Reflow Temperature °C: 250

The high peak reflow temperature provides flexibility in soldering options and ensures reliable joint formation.

Length: 17.9 mm

The compact length helps reduce the overall footprint of the device on the PCB, facilitating size-constrained designs.

Maximum Output Current: 2 A

With a maximum output current of 2 A, this driver can efficiently handle a range of peripheral devices.

Terminal Form: GULL WING

Gull wing terminals support robust mechanical connections and excellent soldering characteristics in surface mount applications.

Nominal Supply Voltage: 13 V

The nominal supply voltage aligns well with common applications, facilitating straightforward integration.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many components, contributing to ease of assembly on PCB.

Driver No. of Bits: 4

A 4-bit driver enhances processing capability in controlling multiple outputs, making it suitable for various peripheral tasks.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate level of moisture sensitivity, allowing for proper handling and storage practices during manufacturing.

Nominal Output Peak Current Limit: 10.5 A

A high peak current limit provides the capability to drive demanding loads, making the driver versatile for high-performance applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based driver, it facilitates multiple signal processing functions, making it adaptable to various designs.

Output Current Flow Direction: SOURCE

The source output current direction enhances flexibility for design applications where devices need to source current to peripherals.

Technical Specifications

Peripheral Drivers VNQ830MTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

10.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ830MTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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