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VNQ810P13TR

STMicroelectronics

VNQ810P13TR by STMicroelectronics

VNQ810P13TR from STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 28-terminal SO package and supports output currents up to 5A. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,126

-

-

-

-

Digiode

USA . 2,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,705

-

-

-

-

Anansix

USA . 2,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,615

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$6.737

100+ parts

-

1k+ parts

$6.063

10k+ parts

-

2,177

$6.737

-

$6.063

-

MKK Technologies

India . 755 parts In-Stock

1+ parts

$12.669

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$12.669

-

-

-

DigiPath Technology Company

USA . 755 parts In-Stock

1+ parts

$12.669

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$12.669

-

-

-

Corphita

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,757

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-

-

-

Parana Technologies

USA . 1,395 parts In-Stock

1+ parts

-

100+ parts

$8.055

1k+ parts

-

10k+ parts

-

1,395

-

$8.055

-

-

Overview

Elevate your designs with the VNQ810P13TR from STMicroelectronics, a powerhouse in peripheral drivers renowned for its exceptional quality and reliability. This compact solution offers robust built-in protections against overcurrent, overvoltage, and thermal events, ensuring seamless operation even in demanding applications. With versatile compatibility and user-friendly features, it empowers you to innovate confidently while enhancing system performance and longevity. Choose STMicroelectronics for unparalleled excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body ensures a lightweight and robust solution, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved manufacturing efficiency, making this driver ideal for modern electronic devices.

Maximum Supply Voltage: 36 V

A high maximum supply voltage of 36 V allows the driver to be used in a wide range of applications, accommodating different operational requirements.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCB layouts, facilitating easier integration into various designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and longevity, safeguarding the driver against common electrical faults and ensuring stable performance.

Power Supplies (V): 8/36

Dual power supply levels from 8 to 36 V increase flexibility for designers, allowing the driver to function effectively in diverse applications.

No. of Terminals: 28

With 28 terminals, this driver supports complex connections, making it ideal for applications requiring multiple inputs and outputs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables designers to save space in their systems without compromising on functionality.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage of 5.5 V makes this driver suitable for battery-operated devices and allows operation in lower power environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve connectivity and corrosion resistance, leading to enhanced overall performance and reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible PCB layout designs, helping engineers to optimize space and component arrangements.

Maximum Seated Height: 2.65 mm

A low maximum seated height supports compact designs, making it suitable for devices where space is a premium.

Width: 7.5 mm

A compact width of 7.5 mm assists in fitting into tight designs, enhancing design versatility.

Length: 17.9 mm

The moderate length allows this device to be integrated into medium-sized layouts without taking up excessive board space.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical strength, ensuring solid electrical connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is optimized for performance, leading to efficient operation in standard applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for high-density component placement, important for modern, space-constrained designs.

Driver No. of Bits: 4

With 4 bits, this driver can manage multiple control signals, enabling more advanced functionalities in peripheral devices.

Nominal Output Peak Current Limit: 5 A

A peak current limit of 5 A is sufficient for powering various peripherals, ensuring robust operation without risk of damage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This driver type facilitates seamless integration with other digital components, enhancing its versatility in system design.

Output Current Flow Direction: SOURCE

As a sourcing driver, it can actively drive loads, resulting in efficient control over connected peripherals.

Technical Specifications

Peripheral Drivers VNQ810P13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VNQ810P13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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