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VNQ860SP

STMicroelectronics

VNQ860SP by STMicroelectronics

VNQ860SP by STMicroelectronics is a peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates within a power supply range of 8-36V and has a nominal output peak current limit of 0.7A. This small outline driver is ideal for applications requiring source output current flow direction in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 7,143 parts In-Stock

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Digiode

USA . 1,654 parts In-Stock

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Anansix

USA . 1,634 parts In-Stock

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1,634

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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200

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Holdelec - ElecDif-Pro

France . 200 parts In-Stock

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200

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Nova Conductors

Japan . 18 parts In-Stock

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18

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 18 parts In-Stock

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$2.366

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18

$2.366

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Aztec Data Supply Inc.

USA . 1,508 parts In-Stock

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$2.580

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1,508

$2.580

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AZTECH Wire

Italy . 895 parts In-Stock

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$6.434

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895

$6.434

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IDEA Electronic Components Group

UK . 1,290 parts In-Stock

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$10.025

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$9.023

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1,290

$10.025

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$9.023

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Microchip USA

USA . 423 parts In-Stock

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$18.271

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423

$18.271

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MKK Technologies

India . 750 parts In-Stock

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$18.852

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750

$18.852

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DigiPath Technology Company

USA . 750 parts In-Stock

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$18.852

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750

$18.852

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Ampacity Inc.

Singapore . 823 parts In-Stock

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$44.500

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$44.500

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Component Stockers USA

USA . 208 parts In-Stock

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$99.990

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$99.990

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RC Electronics

USA . 20,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,583 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,315 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,771 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,050 parts In-Stock

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$11.987

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Lixinc

USA . 371 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 40 parts In-Stock

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Assy Fe

Spain . 20 parts In-Stock

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iodParts Technologies Inc.

India . 12 parts In-Stock

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Overview

Experience the unmatched quality and reliability of STMicroelectronics with the VNQ860SP peripheral driver. This versatile component offers built-in protections against transient events, over current, over voltage, thermal issues, and under voltage, ensuring the safety and longevity of your electronic devices. With a wide range of power supplies from 8V to 36V, this compact driver is perfect for a variety of applications. Trust STMicroelectronics to deliver exceptional value and performance with the VNQ860SP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can handle a wide range of power supply inputs, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, ensuring compatibility with existing designs and equipment.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the product, safeguarding it from potential damage.

Power Supplies (V): 8/36

The wide range of power supply options (8-36V) allows flexibility in voltage selection based on specific application requirements.

No. of Terminals: 10

The ample number of terminals provides connections for various input/output signals, enhancing compatibility with different systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package with a heat sink/slug design helps dissipate heat efficiently, preventing overheating and ensuring stable operation.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage requirement enables operation with low-power sources, increasing energy efficiency.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals enhances conductivity and solderability, ensuring secure connections.

Terminal Position: DUAL

The dual terminal position allows for easy insertion into the circuit board, simplifying installation and maintenance.

Maximum Seated Height: 3.75 mm

The low maximum seated height enables a compact design, suitable for space-constrained applications.

Width: 7.5 mm

The narrow width of the product saves space on the circuit board, contributing to a more efficient layout.

Length: 9.4 mm

The moderate length offers a balanced form factor, promoting easy integration into various electronic setups.

Terminal Form: GULL WING

The gull-wing terminal form facilitates robust solder joints, ensuring secure and reliable connections.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24 V provides a standard operating range, making it compatible with many industrial applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise positioning of terminals, aiding in reliable signal transmission.

Driver No. of Bits: 4

With 4 bits, this driver can accurately control and manipulate various input/output signals, enhancing system performance.

Nominal Output Peak Current Limit: 0.7 A

The nominal output peak current limit of 0.7A ensures safe operation under different load conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides flexibility in signal processing, making it suitable for a wide range of applications.

Output Current Flow Direction: SOURCE

The source output current flow direction simplifies the connection of external devices, ensuring compatibility with common circuit configurations.

Technical Specifications

Peripheral Drivers VNQ860SP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VNQ860SP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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