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VNQ810M-E

STMicroelectronics

VNQ810M-E by STMicroelectronics

VNQ810M-E by STMicroelectronics is a peripheral driver with 4 functions. It has a max supply voltage of 36V and can handle a max output current of 0.6A. This IC type is commonly used as a buffer or inverter based peripheral driver in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,281 parts In-Stock

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Digiode

USA . 2,313 parts In-Stock

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2,313

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Anansix

USA . 218 parts In-Stock

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218

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 964 parts In-Stock

1+ parts

$3.299

100+ parts

-

1k+ parts

$2.969

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964

$3.299

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$2.969

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MKK Technologies

India . 837 parts In-Stock

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$6.204

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837

$6.204

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DigiPath Technology Company

USA . 837 parts In-Stock

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$6.204

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837

$6.204

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$10.126

100+ parts

$9.215

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$8.303

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40

$10.126

$9.215

$8.303

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Ampacity Inc.

Singapore . 801 parts In-Stock

1+ parts

$14.500

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801

$14.500

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AZTECH Wire

Italy . 301 parts In-Stock

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$19.754

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301

$19.754

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Microchip USA

USA . 283 parts In-Stock

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$179.423

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283

$179.423

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Corphita

USA . 3,857 parts In-Stock

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Continental Prestige Electronics

USA . 3,851 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,317 parts In-Stock

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Argo Parts USA

USA . 2,803 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 759 parts In-Stock

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759

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Parana Technologies

USA . 352 parts In-Stock

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$3.945

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352

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$3.945

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Discover the VNQ810M-E by STMicroelectronics, a high-quality peripheral driver that offers numerous advantages for your applications. With its robust built-in protections against transient, over current, over voltage, thermal, and under voltage conditions, this product ensures reliable performance and durability. Designed with a compact rectangular package shape and small outline style, it provides easy integration into various systems. The VNQ810M-E delivers a maximum output current of 0.6 A, allowing efficient power management. Whether you need to control motors or interface with other devices, this buffer or inverter-based peripheral driver is your ideal solution. Experience the value, benefits, and advantages that the VNQ810M-E brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and makes this peripheral driver resistant to external damage, making it a reliable choice.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into electronic circuits, saving time and effort in the assembly process.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36V, this peripheral driver can handle a wide range of voltage inputs, providing flexibility in various applications.

No. of Functions: 4

Having 4 functions in a single driver allows for efficient control and management of peripheral devices, reducing the overall component count and simplifying the design.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB layouts, ensuring easy integration and placement within electronic systems.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections for transient, over current, over voltage, thermal and under voltage conditions safeguard both the peripheral driver and connected devices, enhancing reliability and preventing damage.

Power Supplies (V): 8/36

The wide range of power supply voltage (8V to 36V) compatibility allows this peripheral driver to be utilized in different voltage environments, making it versatile and adaptable.

No. of Terminals: 28

With 28 terminals, this peripheral driver provides sufficient connectivity options for various peripheral devices, offering flexibility in designing and connecting external components.

Package Style (Meter): SMALL OUTLINE

The small outline of the package enables space-saving integration, making it suitable for applications where board space is limited.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage requirement of 5.5V ensures operation even in low voltage scenarios, providing reliability and versatility in different power conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent electrical conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

The dual terminal position allows for increased versatility in connecting peripheral devices, providing options for different wiring configurations.

Maximum Seated Height: 2.65 mm

With a low maximum seated height, this peripheral driver can be mounted in compact spaces, optimizing overall system design and layout.

Width: 7.5 mm

The narrow width of 7.5mm enables efficient space utilization, especially in applications where minimizing board footprint is crucial.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during the assembly process.

Peak Reflow Temperature °C: 250

The peak reflow temperature capability of 250°C enables compatibility with standard soldering processes, facilitating easy and efficient manufacturing.

Length: 17.9 mm

The moderate length of 17.9mm provides a compact form factor, making this peripheral driver suitable for applications where space is limited.

Maximum Output Current: 0.6 A

The maximum output current of 0.6A allows for driving peripheral devices with sufficient power, ensuring proper functionality and performance.

Terminal Form: GULL WING

The gull wing terminal form provides reliable contact and soldering points, making it easier for assembly and enhancing overall product durability.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V ensures compatibility in applications where a specific voltage level is required, providing stable and reliable operation.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy alignment and connection of peripheral devices, simplifying the overall wiring process.

Driver No. of Bits: 4

The 4-bit driver configuration provides sufficient data control capabilities, enabling precise and efficient operation of peripheral devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this peripheral driver can withstand moderate levels of moisture exposure, ensuring reliability in normal operating conditions.

Nominal Output Peak Current Limit: 0.9 A

The nominal output peak current limit of 0.9A ensures safe and efficient operation within the specified current range, offering stable performance for connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver functions as a buffer or inverter, allowing seamless communication and control between the microcontroller and peripheral devices.

Output Current Flow Direction: SOURCE

With a source output current flow direction, this peripheral driver can deliver power to connected devices, enabling them to function correctly and reliably.

Technical Specifications

Peripheral Drivers VNQ810M-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ810M-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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