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VNQ83013TR

STMicroelectronics

VNQ83013TR by STMicroelectronics

VNQ83013TR by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and an output current limit of 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,830 parts In-Stock

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6,830

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Chip Stock

USA . 5,800 parts In-Stock

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5,800

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Digiode

USA . 2,725 parts In-Stock

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2,725

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Anansix

USA . 1,411 parts In-Stock

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1,411

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Bristol Electronics

USA . 121 parts In-Stock

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121

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Dan-Mar Components

USA . 121 parts In-Stock

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121

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Q Components

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 544 parts In-Stock

1+ parts

$4.036

100+ parts

-

1k+ parts

$3.632

10k+ parts

-

544

$4.036

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$3.632

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MKK Technologies

India . 931 parts In-Stock

1+ parts

$7.590

100+ parts

-

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931

$7.590

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DigiPath Technology Company

USA . 931 parts In-Stock

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$7.590

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931

$7.590

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Microchip USA

USA . 380 parts In-Stock

1+ parts

$9.338

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380

$9.338

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$9.780

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312

$9.780

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Component Stockers USA

USA . 540 parts In-Stock

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$99.990

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540

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 3,904 parts In-Stock

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3,904

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Parana Technologies

USA . 1,720 parts In-Stock

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$4.826

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1,720

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$4.826

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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iodParts Technologies Inc.

India . 121 parts In-Stock

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121

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Kepictronics

USA . 81 parts In-Stock

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81

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Overview

Elevate your projects with the VNQ83013TR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality peripheral driver promises exceptional reliability and performance across various applications, from automotive to industrial controls. Featuring robust built-in protections, it ensures peak efficiency while safeguarding your systems. Experience seamless integration and trust in a manufacturer that prioritizes excellence, delivering unparalleled value and peace of mind for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and compact design, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into modern circuit boards and saves space compared to through-hole components.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this peripheral driver is versatile and can support a wide range of applications.

No. of Functions: 2

The dual functionality enhances flexibility, allowing for various tasks within a single chip, reducing component count.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB layouts while providing a stable mounting platform.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These built-in protections enhance reliability and safety, preventing damage to the device and connected components under adverse conditions.

Power Supplies (V): 13

Designed for a nominal supply voltage of 13V which is common in many applications, ensuring compatibility.

No. of Terminals: 28

With 28 terminals, this driver supports multiple connections, allowing for complex designs without sacrificing functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications while maintaining performance.

Minimum Supply Voltage: 5.5 V

With a lower minimum supply voltage, this peripheral driver can operate in low-power applications, providing energy efficiency.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent solderability and corrosion resistance, leading to better reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile layout options on PCB, facilitating easier routing of connections.

Maximum Seated Height: 2.65 mm

A compact height helps to save vertical space on PCBs, making it suitable for slim devices.

Width: 7.5 mm

A width of 7.5 mm makes it suitable for dense layouts where space is limited, enabling high-density designs.

Maximum Time At Peak Reflow Temperature (s): 30

The tolerance for a longer peak reflow time accommodates various assembly processes, enhancing manufacturing flexibility.

Peak Reflow Temperature °C: 250

A high peak reflow temperature indicates compatibility with advanced soldering techniques and materials.

Length: 17.9 mm

The length of 17.9 mm strikes a balance between size and functionality, allowing for practicality in various applications.

Maximum Output Current: 2 A

A maximum output current of 2A ensures the driver can handle moderate load requirements effectively.

Terminal Form: GULL WING

Gull wing terminal forms provide enhanced mechanical stability and ease of soldering in automated assembly processes.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V offers consistency and reliability in performance across applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compatibility with standard footprints, simplifying PCB design and assembly.

Driver No. of Bits: 4

A 4-bit driver enables a balance between complexity and control, suitable for various signal processing needs.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates suitable precautions are needed, providing guidelines for handling to ensure reliability.

Nominal Output Peak Current Limit: 9 A

With a generous peak current limit of 9A, this device can manage high transient loads, making it robust for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification as a buffer or inverter-based driver showcases versatility in interfacing and signal integrity management.

Output Current Flow Direction: SINK

The sink direction of output current allows for effective control and integration in a variety of circuit designs.

Technical Specifications

Peripheral Drivers VNQ83013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ83013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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