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VND600P-E

STMicroelectronics

VND600P-E by STMicroelectronics

VND600P-E by STMicroelectronics is a 16-terminal peripheral driver with power supplies ranging from 8V to 36V. It features a nominal output peak current limit of 40A and is designed as a buffer or inverter-based peripheral driver for sink output current flow direction. This rectangular, small outline package is suitable for various applications requiring high-current driving capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,614

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-

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Anansix

USA . 2,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,732

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Digiode

USA . 1,798 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,189 parts In-Stock

1+ parts

$10.031

100+ parts

-

1k+ parts

$9.028

10k+ parts

-

2,189

$10.031

-

$9.028

-

AZTECH Wire

Italy . 168 parts In-Stock

1+ parts

$12.370

100+ parts

-

1k+ parts

-

10k+ parts

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168

$12.370

-

-

-

Microchip USA

USA . 249 parts In-Stock

1+ parts

$15.147

100+ parts

-

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249

$15.147

-

-

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MKK Technologies

India . 211 parts In-Stock

1+ parts

$18.862

100+ parts

-

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10k+ parts

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211

$18.862

-

-

-

DigiPath Technology Company

USA . 211 parts In-Stock

1+ parts

$18.862

100+ parts

-

1k+ parts

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10k+ parts

-

211

$18.862

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-

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RC Electronics

USA . 40,968 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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40,968

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A-Z Elektronik GmbH

Germany . 6,629 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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6,629

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Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

-

100+ parts

$11.993

1k+ parts

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2,207

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$11.993

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Corphita

USA . 1,475 parts In-Stock

1+ parts

-

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1,475

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Overview

Enhance your electronic designs with the VND600P-E by STMicroelectronics, a high-quality peripheral driver offering reliable performance and versatility. With a wide range of applications and a reputation for excellence, STMicroelectronics delivers exceptional value to customers seeking innovative solutions. The VND600P-E stands out for its efficiency and durability, making it a must-have component for your next project. Upgrade your designs today with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions, making the product long-lasting.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, ensuring stability during operation.

Power Supplies (V): 8/36

Wide range of power supply options for compatibility with different systems and applications.

No. of Terminals: 16

Sufficient terminals for connecting to multiple components, enhancing versatility and functionality.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space and allows for more efficient PCB layout.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring consistent performance over time.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity, reducing the risk of signal loss or interference.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure soldering, ensuring strong connections and reliability.

Driver No. of Bits: 2

2-bit driver offers basic control and functionality, suitable for simple peripheral driving applications.

Nominal Output Peak Current Limit: 40 A

High peak current limit allows for driving power-hungry peripherals without risking damage to the driver.

Output Current Flow Direction: SINK

Sink output current flow direction is suitable for applications where peripherals require a sink for current flow.

Technical Specifications

Peripheral Drivers VND600P-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

40 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND600P-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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