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VND600PEP13TR

STMicroelectronics

VND600PEP13TR by STMicroelectronics

VND600PEP13TR from STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 24-terminal design for efficient surface mounting. Ideal for automotive and industrial applications, it operates within a nominal voltage of 13V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,237

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-

-

-

Digiode

USA . 1,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

-

-

-

-

Vyrian

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,564 parts In-Stock

1+ parts

$4.915

100+ parts

-

1k+ parts

$4.423

10k+ parts

-

1,564

$4.915

-

$4.423

-

MKK Technologies

India . 766 parts In-Stock

1+ parts

$9.242

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$9.242

-

-

-

DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$9.242

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$9.242

-

-

-

Corphita

USA . 4,471 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,471

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-

-

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Parana Technologies

USA . 2,270 parts In-Stock

1+ parts

-

100+ parts

$5.876

1k+ parts

-

10k+ parts

-

2,270

-

$5.876

-

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Overview

Unlock unparalleled performance with the VND600PEP13TR from STMicroelectronics, a leader in advanced semiconductor solutions. This robust peripheral driver offers exceptional reliability and built-in protections against transients, overcurrent, and thermal issues, ensuring your applications run smoothly. Ideal for demanding environments, it delivers power efficiently while minimizing risk, making it the perfect choice for automotive and industrial uses. Experience the quality and innovation that STMicroelectronics brings to the table!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction using plastic/epoxy ensures reliability and longevity in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easier integration into modern PCB designs, enhancing design versatility.

Maximum Supply Voltage: 36 V

High maximum supply voltage provides flexibility for different applications requiring robust power management.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on the PCB, allowing for denser circuitry arrangements.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multi-layer protection mechanisms ensure device and circuit safety, enhancing longevity and reliability.

Power Supplies (V): 8/36

Wide range of acceptable supply voltages offers compatibility with numerous applications and power sources.

No. of Terminals: 24

Ample number of terminals allows for increased connectivity options, making it versatile for various designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Compact packaging contributes to space-saving designs without sacrificing performance, ideal for tight layouts.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage ensures compatibility with a wide range of lower-voltage applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier connections and better routing flexibility on the PCB.

Maximum Seated Height: 2.22 mm

Low seated height makes this driver suitable for slim designs and applications with height constraints.

Width: 7.5 mm

Narrow width enables efficient use of PCB real estate, perfect for compact applications.

Length: 10.3 mm

Compact length aids in fitting multiple components in confined spaces without performance compromise.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering processes, improving assembly efficiency and reliability.

Nominal Supply Voltage: 13 V

Nominal voltage is optimal for maximizing performance in standard operational conditions.

Terminal Pitch: 0.8 mm

Tight terminal pitch supports high-density layouts, allowing for more components on a single PCB.

Driver No. of Bits: 2

Two-bit driver configuration enables precise control for various peripherals, enhancing functional capabilities.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface type allows this driver to effectively manage various peripheral devices.

Output Current Flow Direction: SOURCE

Source current flow direction is advantageous for driving loads effectively in most configurations.

Technical Specifications

Peripheral Drivers VND600PEP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.22 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

VND600PEP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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