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VND600TR-E

STMicroelectronics

VND600TR-E by STMicroelectronics

VND600TR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting dual functions. It features built-in protections against overcurrent and thermal issues, making it ideal for robust applications. Its compact design (7.5mm x 10.3mm) ensures efficient integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,244 parts In-Stock

1+ parts

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1k+ parts

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1,244

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Anansix

USA . 1,173 parts In-Stock

1+ parts

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1k+ parts

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1,173

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Vyrian

USA . 845 parts In-Stock

1+ parts

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845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 380 parts In-Stock

1+ parts

$7.549

100+ parts

-

1k+ parts

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10k+ parts

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380

$7.549

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-

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IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$13.699

100+ parts

-

1k+ parts

$12.329

10k+ parts

-

223

$13.699

-

$12.329

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MKK Technologies

India . 712 parts In-Stock

1+ parts

$25.760

100+ parts

-

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712

$25.760

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DigiPath Technology Company

USA . 712 parts In-Stock

1+ parts

$25.760

100+ parts

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712

$25.760

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Component Stockers USA

USA . 678 parts In-Stock

1+ parts

$99.990

100+ parts

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678

$99.990

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A-Z Elektronik GmbH

Germany . 7,166 parts In-Stock

1+ parts

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7,166

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Parana Technologies

USA . 2,274 parts In-Stock

1+ parts

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100+ parts

$16.379

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2,274

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$16.379

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Corphita

USA . 1,943 parts In-Stock

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1,943

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Overview

Elevate your designs with the VND600TR-E from STMicroelectronics, a leader in innovative semiconductor solutions. This robust peripheral driver delivers unmatched reliability and integrated protections against overcurrent, overvoltage, and thermal issues, ensuring your projects stay on track. Perfect for automotive and industrial applications, it brings peace of mind with its high-performance features, enhancing efficiency while minimizing downtime. Choose VND600TR-E for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easy integration onto modern circuit boards, enhancing versatility in PCB layouts.

Maximum Supply Voltage: 36 V

The high maximum supply voltage enables the driver to be used in a wide range of applications, supporting high-performance systems.

No. of Functions: 2

With two functions integrated, this driver can handle multiple tasks while optimizing space and reducing component count.

Package Shape: RECTANGULAR

The rectangular shape provides a consistent footprint, allowing for efficient layout and routing on PCBs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure reliability and longevity by safeguarding against common electrical faults.

Power Supplies (V): 8/36

The power supply range supports a variety of operational requirements, making it flexible for different designs.

No. of Terminals: 16

With 16 terminals, the product offers plenty of connectivity options for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package saves valuable board space, allowing for more compact device designs.

Minimum Supply Voltage: 5.5 V

A lower minimum supply voltage expands the application range, making it suitable for low-power configurations.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures reliable connections and enhances durability against corrosion.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility and ease of manufacturing.

Maximum Seated Height: 2.65 mm

A low profile height is advantageous for slimline devices and provides design flexibility.

Width: 7.5 mm

The compact width allows for high-density layouts, which is essential in today’s miniaturized electronics.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow time contributes to effective soldering processes, ensuring reliability in assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability makes it compatible with various soldering techniques.

Length: 10.3 mm

The length is well-suited for compact designs while providing ample terminal arrangement possibilities.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and facilitate easier inspection during assembly.

Nominal Supply Voltage: 13 V

With a nominal supply voltage of 13 V, the device balances performance and energy efficiency in operation.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with various PCB designs and assembly processes.

Driver No. of Bits: 2

Having two bits means that the driver can interface efficiently with multiple signals, enhancing versatility in communication protocols.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate handling precautions, ensuring reliability during assembly.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter allows this driver to effectively condition and strengthen the signal for downstream components.

Output Current Flow Direction: SOURCE

The source direction for the output current allows for effective driving of downstream loads, increasing application flexibility.

Technical Specifications

Peripheral Drivers VND600TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND600TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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