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VND600SP

STMicroelectronics

VND600SP by STMicroelectronics

VND600SP by STMicroelectronics is a 10-terminal peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at a supply voltage range of 5.5V to 36V and has a small outline package style suitable for buffer or inverter-based interface IC applications. The device is designed for surface mount assembly and features gull wing terminals with matte tin finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 8,100 parts In-Stock

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8,100

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Vyrian

USA . 7,161 parts In-Stock

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7,161

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Digiode

USA . 4,281 parts In-Stock

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4,281

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Anansix

USA . 2,499 parts In-Stock

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2,499

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Greenchips

USA . 384 parts In-Stock

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384

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

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200

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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Pegasus Components GmbH

Germany . 33 parts In-Stock

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33

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$8.990

100+ parts

-

1k+ parts

$8.091

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1,668

$8.990

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$8.091

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MKK Technologies

India . 723 parts In-Stock

1+ parts

$16.906

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723

$16.906

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DigiPath Technology Company

USA . 723 parts In-Stock

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$16.906

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723

$16.906

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Microchip USA

USA . 129 parts In-Stock

1+ parts

$18.333

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129

$18.333

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AZTECH Wire

Italy . 471 parts In-Stock

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$19.677

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471

$19.677

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Ampacity Inc.

Singapore . 140 parts In-Stock

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$42.500

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140

$42.500

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Lixinc

USA . 15,141 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Perfect Parts

USA . 3,797 parts In-Stock

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Corphita

USA . 3,071 parts In-Stock

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3,071

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Parana Technologies

USA . 2,229 parts In-Stock

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$10.749

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$10.749

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Continental Prestige Electronics

USA . 1,343 parts In-Stock

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Argo Parts USA

USA . 759 parts In-Stock

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759

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A-Z Elektronik GmbH

Germany . 539 parts In-Stock

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539

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Authorized Procurement Solutions

USA . 350 parts In-Stock

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350

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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iodParts Technologies Inc.

India . 4 parts In-Stock

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4

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Overview

Enhance your electronic projects with the VND600SP by STMicroelectronics, a high-quality peripheral driver that offers exceptional reliability and performance. Manufactured by industry leader STMicroelectronics, this product is designed to provide top-notch protection against transient, over current, over voltage, thermal, and under voltage issues. With its compact design and versatile applications, the VND600SP is the perfect solution for a wide range of projects. Trust in STMicroelectronics to deliver cutting-edge technology that meets your needs. Experience the value and benefits that this product brings to your work today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to heat, making the product suitable for various operating conditions.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and improving efficiency.

Maximum Supply Voltage: 36 V

Can handle high voltage inputs, making it versatile for different applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Ensures safety and reliability by protecting the peripheral driver and connected devices from potential damages or malfunctions.

No. of Terminals: 10

Provides multiple connection points for interfacing with external components, increasing flexibility in system design.

Width: 7.5 mm

Compact size allows for easy integration into space-constrained devices or applications.

Technical Specifications

Peripheral Drivers VND600SP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND600SP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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