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VND60013TR

STMicroelectronics

VND60013TR by STMicroelectronics

VND60013TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V, supporting up to 40A output current. It features built-in protections against overcurrent and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,533 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,533

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Vyrian

USA . 1,960 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

-

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1,960

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Digiode

USA . 842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

$3.899

10k+ parts

-

2,044

$4.332

-

$3.899

-

MKK Technologies

India . 221 parts In-Stock

1+ parts

$8.147

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$8.147

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-

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$8.147

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$8.147

-

-

-

AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$16.770

100+ parts

-

1k+ parts

-

10k+ parts

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330

$16.770

-

-

-

Microchip USA

USA . 450 parts In-Stock

1+ parts

$16.804

100+ parts

-

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-

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450

$16.804

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-

-

Component Stockers USA

USA . 684 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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684

$99.990

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-

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A-Z Elektronik GmbH

Germany . 6,354 parts In-Stock

1+ parts

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100+ parts

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6,354

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Corphita

USA . 2,045 parts In-Stock

1+ parts

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2,045

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Parana Technologies

USA . 971 parts In-Stock

1+ parts

-

100+ parts

$5.180

1k+ parts

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10k+ parts

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971

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$5.180

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Kepictronics

USA . 209 parts In-Stock

1+ parts

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209

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Overview

Unlock the potential of your designs with the VND60013TR from STMicroelectronics—a trusted leader in innovative electronic solutions. This robust peripheral driver ensures exceptional performance and reliability, featuring built-in protections against overcurrent, voltage spikes, and thermal issues. Ideal for automotive and industrial applications, it delivers seamless integration and peace of mind. Elevate your projects with a component that prioritizes quality and versatility, tailored to meet your demanding needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy material ensures reliability and longevity in various operating environments.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic circuits.

Maximum Supply Voltage: 36 V

High maximum supply voltage capability makes this driver suitable for a wide range of applications requiring robust power.

Package Shape: RECTANGULAR

Rectangular shape facilitates efficient layout and space optimization on printed circuit boards (PCBs).

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protection safeguards against common electrical issues, enhancing reliability and safety.

Power Supplies (V): 8/36

Supports a wide voltage range, providing versatility for various peripheral applications.

No. of Terminals: 16

A sufficient number of terminals allows for multiple connections and enhanced functionality in peripheral driving.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact package style with heat sink capability helps in efficient heat dissipation, allowing the device to operate at higher power levels.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage ensures compatibility with devices operating at minimal power requirements.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal position facilitates better connectivity and layout options in PCB design.

Maximum Seated Height: 3.75 mm

A low seated height allows for more efficient use of space within compact electronic devices.

Width: 7.5 mm

Narrow width contributes to the compact form factor, making it ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time provides compatibility with various PCB assembly processes, ensuring reliability in production.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports lead-free soldering processes, aligning with modern manufacturing standards.

Length: 9.4 mm

Short length helps in minimizing space usage, perfect for compact designs.

Terminal Form: GULL WING

Gull wing terminal form enhances mechanical stability and provides ease of soldering in surface mount applications.

Nominal Supply Voltage: 13 V

Optimal nominal supply voltage of 13V serves a wide range of application requirements, providing stable operation.

Terminal Pitch: 1.27 mm

Standard terminal pitch aids in easy hand soldering and compatible with common PCB designs.

Driver No. of Bits: 2

The integrated 2-bit driver allows flexible control of connected peripherals, enhancing functionality.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures proper handling and storage while providing reliable performance in standard environments.

Nominal Output Peak Current Limit: 40 A

High current limit capability allows the driver to manage significant loads, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface type ensures compatibility with a variety of devices, simplifying circuit design.

Output Current Flow Direction: SINK

Sink current capability enables efficient control of multiple peripheral devices, enhancing system versatility.

Technical Specifications

Peripheral Drivers VND60013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

40 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND60013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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