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VND600-E

STMicroelectronics

VND600-E by STMicroelectronics

VND600-E by STMicroelectronics is a dual-function peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact SO package (7.5mm x 10.3mm) for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,567

-

-

-

-

Digiode

USA . 4,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,563

-

-

-

-

Anansix

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,756 parts In-Stock

1+ parts

$11.157

100+ parts

-

1k+ parts

$10.041

10k+ parts

-

1,756

$11.157

-

$10.041

-

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$18.880

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$18.880

-

-

-

MKK Technologies

India . 2,136 parts In-Stock

1+ parts

$20.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,136

$20.980

-

-

-

DigiPath Technology Company

USA . 2,136 parts In-Stock

1+ parts

$20.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,136

$20.980

-

-

-

Microchip USA

USA . 404 parts In-Stock

1+ parts

$34.704

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$34.704

-

-

-

Corphita

USA . 2,125 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,125

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-

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Parana Technologies

USA . 257 parts In-Stock

1+ parts

-

100+ parts

$13.340

1k+ parts

-

10k+ parts

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257

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$13.340

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iodParts Technologies Inc.

India . 3 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3

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Overview

Discover the VND600-E by STMicroelectronics, a reliable peripheral driver designed for optimal performance and efficiency. With robust built-in protections against transient surges, overcurrent, and thermal issues, it ensures durability in demanding applications. Trusted globally for quality, STMicroelectronics delivers unmatched value, empowering your designs with enhanced reliability and flexibility. Elevate your projects—make every connection count!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Being surface mount allows for a compact design, enabling space-saving applications and easier integration into modern circuitry.

Maximum Supply Voltage: 36 V

A high maximum supply voltage makes the driver versatile and suitable for a wide range of applications requiring robust performance.

No. of Functions: 2

Featuring two functions enhances flexibility, allowing for the efficient integration of multiple operations in a single component.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient layout design in PCBs and promotes optimal space utilization.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure operational safety and reduce risks of damage, increasing overall product reliability.

Power Supplies (V): 8/36

This range supports various power configurations, making the product adaptable to different systems and requirements.

No. of Terminals: 16

With 16 terminals, the product can support complex circuit designs, facilitating easy connections and enhancing versatility.

Package Style (Meter): SMALL OUTLINE

A small outline package allows for high-density mounting, which is ideal for space-constrained applications in modern electronics.

Minimum Supply Voltage: 5.5 V

The low minimum voltage requirement enhances compatibility with a broader spectrum of components, making it easy to integrate.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and reliability in connections, improving overall performance.

Terminal Position: DUAL

Dual terminal positioning aids in easier layout design and integration, offering flexibility in PCB design.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a low-profile design, ideal for applications where height restrictions are critical.

Width: 7.5 mm

The compact width facilitates placement in tight spaces, allowing for more efficient board design.

Maximum Time At Peak Reflow Temperature: 30 s

A permissible peak reflow time of 30 seconds supports the use of advanced soldering techniques, ensuring robust assembly.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance ensures compatibility with modern soldering materials and methods, enhancing assembly reliability.

Length: 10.3 mm

The length is optimized for standard PCB footprints, making it easy to fit into various designs without extensive modification.

Terminal Form: GULL WING

Gull-wing terminals provide improved solder joint strength and are easier to inspect visually, enhancing maintenance and reliability.

Nominal Supply Voltage: 13 V

A nominal voltage of 13 V indicates efficient operation within this range, providing a balance of performance and energy consumption.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for widespread compatibility with existing design tools and PCB layouts.

Driver No. of Bits: 2

The 2-bit driver provides basic yet effective control, suitable for a wide variety of peripheral functions.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures adequate handling precautions for moisture sensitivity, promoting better manufacturing outcomes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The option for buffer or inverter configurations allows for tailored signal processing solutions to meet specific application needs.

Output Current Flow Direction: SOURCE

The source output current direction is beneficial for driving loads directly, simplifying circuit design and reducing external components.

Technical Specifications

Peripheral Drivers VND600-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND600-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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