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TSM114CN

STMicroelectronics

TSM114CN by STMicroelectronics

TSM114CN by STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and supports up to 24V. It features 4 channels, operates b/w 0 °C and 95 °C, and comes in a compact rectangular package. Ideal for power supply support circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,661 parts In-Stock

1+ parts

-

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8,661

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-

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Digiode

USA . 2,369 parts In-Stock

1+ parts

-

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-

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2,369

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Anansix

USA . 1,444 parts In-Stock

1+ parts

-

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1,444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$18.690

100+ parts

-

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-

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560

$18.690

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-

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IDEA Electronic Components Group

UK . 1,376 parts In-Stock

1+ parts

$21.276

100+ parts

-

1k+ parts

$19.148

10k+ parts

-

1,376

$21.276

-

$19.148

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Microchip USA

USA . 488 parts In-Stock

1+ parts

$28.181

100+ parts

-

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488

$28.181

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$28.945

100+ parts

$26.340

1k+ parts

$23.735

10k+ parts

-

2,000

$28.945

$26.340

$23.735

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MKK Technologies

India . 739 parts In-Stock

1+ parts

$40.008

100+ parts

-

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739

$40.008

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-

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DigiPath Technology Company

USA . 739 parts In-Stock

1+ parts

$40.008

100+ parts

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739

$40.008

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Parana Technologies

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

$25.439

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1,400

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$25.439

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Vigor

Singapore . 1,079 parts In-Stock

1+ parts

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1,079

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Corphita

USA . 1,049 parts In-Stock

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1,049

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Overview

Unlock the potential of your designs with the TSM114CN from STMicroelectronics, a trusted leader in power management solutions. This versatile IC delivers reliable performance across various applications, ensuring stability and efficiency while minimizing energy waste. With its robust design and ease of integration, the TSM114CN empowers engineers to enhance their projects, ultimately driving innovation and value for customers seeking quality and durability in their electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard for many applications, simplifying integration with common power sources.

No. of Terminals: 14

With 14 terminals, this IC provides ample connectivity options while maintaining a manageable layout for circuit design.

Package Style (Meter): IN-LINE

The in-line package style fits well in various circuit configurations, facilitating easy assembly in both manual and automated processes.

Maximum Operating Temperature: 95 °C

A maximum operating temperature of 95 °C allows the IC to function reliably in high-temperature environments without failure.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C ensures that this IC can function effectively in low-temperature conditions, expanding its application range.

Terminal Position: DUAL

The dual terminal positioning enhances design flexibility, allowing for more efficient routing on printed circuit boards.

Maximum Seated Height: 5.1 mm

A maximum seated height of 5.1 mm ensures compatibility with other components, facilitating compact circuit designs.

Width: 7.62 mm

The compact width of 7.62 mm makes it suitable for space-constrained applications while maintaining performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply management, this IC optimizes system efficiency and reliability in power distribution.

Minimum Supply Voltage (Vsup): 4.2 V

The minimum supply voltage of 4.2V allows for flexible design choices, catering to varied application power requirements.

No. of Channels: 4

With four channels, this IC can manage multiple power supplies simultaneously, enhancing system efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are suitable for high power applications, ensuring durability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, facilitating compatibility with a wide range of PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 24 V

A maximum supply voltage of 24V allows the IC to be used in a variety of high-voltage applications, increasing its versatility.

Technical Specifications

Power Management ICs TSM114CN attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T14

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TSM114CN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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