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TSH330IDT

STMicroelectronics

TSH330IDT by STMicroelectronics

TSH330IDT by STMicroelectronics is a wideband operational amplifier with a max input offset voltage of 7 mV and a common mode reject ratio of 54 dB. It operates at ±2.5/5 V, suitable for industrial applications. Its compact SO package ensures efficient surface mounting.

Median Price

$1.379

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.379

1,876

-

-

-

$1.379

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,317 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

-

10k+ parts

-

4,317

$2.802

-

-

-

Vyrian

USA . 3,685 parts In-Stock

1+ parts

$2.950

100+ parts

-

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-

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-

3,685

$2.950

-

-

-

Zilex Electronics Inc.

Canada . 2,200 parts In-Stock

1+ parts

-

100+ parts

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2,200

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-

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Anansix

USA . 1,772 parts In-Stock

1+ parts

-

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1,772

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-

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Bristol Electronics

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$1.091

1k+ parts

$0.960

10k+ parts

-

1,600

-

$1.091

$0.960

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Dan-Mar Components

USA . 1,600 parts In-Stock

1+ parts

-

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1,600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,196 parts In-Stock

1+ parts

$2.655

100+ parts

-

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4,196

$2.655

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Vigor

Singapore . 2,388 parts In-Stock

1+ parts

$2.920

100+ parts

-

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2,388

$2.920

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Microchip USA

USA . 116 parts In-Stock

1+ parts

$4.056

100+ parts

-

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116

$4.056

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$4.146

100+ parts

-

1k+ parts

$3.732

10k+ parts

-

1,543

$4.146

-

$3.732

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MKK Technologies

India . 2,190 parts In-Stock

1+ parts

$7.797

100+ parts

-

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2,190

$7.797

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DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$7.797

100+ parts

-

1k+ parts

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2,190

$7.797

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Component Stockers USA

USA . 753 parts In-Stock

1+ parts

$99.990

100+ parts

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753

$99.990

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Perfect Parts

USA . 10,093 parts In-Stock

1+ parts

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10,093

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Parana Technologies

USA . 2,245 parts In-Stock

1+ parts

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100+ parts

$4.958

1k+ parts

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2,245

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$4.958

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-

Overview

Unlock exceptional performance with the TSH330IDT from STMicroelectronics, a trusted leader in operational amplifiers. Designed for reliability and versatility, this compact op amp excels in industrial applications, ensuring high precision and stability even in extreme conditions. Benefit from its low power consumption and impressive common mode rejection, making it ideal for demanding electronic projects. Elevate your designs with ST's commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures robustness for industrial applications.

Maximum Input Offset Voltage: 7000 uV

A lower offset voltage enhances precision, making it suitable for high-accuracy applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB space utilization and ease of assembly.

Package Shape: RECTANGULAR

Rectangular shape fits well in standard layouts for optimal board space usage.

Nominal Common Mode Reject Ratio: 54 dB

A high CMRR is vital for maintaining signal integrity in noisy environments.

Nominal Supply Voltage / Vsup: 2.5 V

This voltage level is well-suited for modern low-voltage applications.

Power Supplies (V): +-2.5/5

Flexible supply options allow for versatility in design and application.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline packages save board space and are convenient for compact designs.

Maximum Supply Voltage Limit: 3 V

This limit ensures safety and reliability in low-power applications.

Maximum Operating Temperature: 85 °C

Able to function in high-temperature environments, making it suitable for industrial applications.

Maximum Bias Current (IIB) @25°C: 55 uA

Low bias current minimizes impact on circuit performance.

Frequency Compensation: YES

This feature ensures stability and performance across a range of frequencies.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances solderability and improves long-term reliability.

Terminal Position: DUAL

Dual terminal positioning supports various layout designs effectively.

Maximum Seated Height: 1.75 mm

Low profile design aids in creating slim and compact circuits.

Width: 3.9 mm

Compact width allows for higher density in PCB design.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for effective soldering while minimizing the risk of thermal damage.

Peak Reflow Temperature °C: 260

Compatible with lead-free soldering processes commonly used in modern manufacturing.

Length: 4.9 mm

Optimized length for space-efficient PCB integration.

Temperature Grade: INDUSTRIAL

Designed to meet the demanding requirements of industrial applications.

Maximum Negative Supply Voltage Limit: -3 V

Allows flexibility in circuit design with potential for dual-supply configurations.

Technology: BIPOLAR

Bipolar technology provides high speed and low noise characteristics.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical strength and improve solderability.

Amplifier Type: OPERATIONAL AMPLIFIER

Versatile amplifier type suitable for various applications including filtering, amplifying, and analog processing.

Maximum Supply Current: 20.2 mA

Reasonable supply current allows for energy-efficient designs.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Supports dual-supply operations, enabling better performance in signal processing.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture enhances bandwidth and response speed.

Packing Method: TAPE AND REEL

Efficient packing promotes automated assembly, reducing manufacturing time.

Nominal Slow Rate: 1800 V/us

High slew rate allows for quick response to fast-changing signals.

Terminal Pitch: 1.27 mm

Standard terminal pitch makes it compatible with various PCB designs.

Wideband: YES

Wide bandwidth capability supports high-frequency applications effectively.

Technical Specifications

Operational Amplifiers (Op Amps) TSH330IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Power Supply:

±2.5/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

54 dB

Input Offset Voltage Limit:

7000 uV

Nominal Slew Rate:

1800 V/us

Maximum Bias Current (IIB) @25 °C:

55 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

20.2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH330IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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