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TSH310IDT

STMicroelectronics

TSH310IDT by STMicroelectronics

TSH310IDT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 6500 µV and a common mode reject ratio of 61 dB. It operates within -40 °C to 85 °C, making it ideal for industrial applications. This compact, surface-mount device supports dual supply voltages of ±2.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,398 parts In-Stock

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4,398

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Vyrian

USA . 4,182 parts In-Stock

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4,182

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Zilex Electronics Inc.

Canada . 2,600 parts In-Stock

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2,600

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Anansix

USA . 1,808 parts In-Stock

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1,808

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,178 parts In-Stock

1+ parts

$3.063

100+ parts

-

1k+ parts

$2.756

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-

1,178

$3.063

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$2.756

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MKK Technologies

India . 1,344 parts In-Stock

1+ parts

$5.759

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1,344

$5.759

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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$5.759

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1,344

$5.759

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AZTECH Wire

Italy . 152 parts In-Stock

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$11.300

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152

$11.300

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Microchip USA

USA . 183 parts In-Stock

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$17.917

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183

$17.917

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A-Z Elektronik GmbH

Germany . 5,426 parts In-Stock

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5,426

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Vigor

Singapore . 3,864 parts In-Stock

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3,864

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Corphita

USA . 682 parts In-Stock

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682

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Parana Technologies

USA . 424 parts In-Stock

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$3.662

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424

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$3.662

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Overview

Experience the precision of STMicroelectronics' TSH310IDT operational amplifier, designed for superior performance in demanding applications. With its exceptional common mode rejection and low power consumption, this micropower device ensures reliability in industrial settings. Ideal for signal processing and conditioning, the TSH310IDT stands out with robust build quality and versatile packaging options, delivering unmatched value that enhances your projects while saving you time and resources.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures reliable performance and protection against environmental factors.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage improves accuracy in signal amplification, making it suitable for precision applications.

Surface Mount: YES

Surface mount technology allows for easier integration into modern circuit designs and efficient use of PCB space.

Package Shape: RECTANGULAR

The rectangular design allows for convenient arrangement on PCB layouts, optimizing space utilization.

Nominal Common Mode Reject Ratio: 61 dB

A high CMRR indicates strong rejection of common signals, enhancing performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 2.5

This nominal supply voltage makes it compatible with low-power applications, leading to energy efficiency.

Power Supplies (V): ±2.5/5

Supports dual supply voltages, providing flexibility in various application requirements.

No. of Terminals: 8

The 8-terminal design allows for versatile connections and integration into various circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact electronic designs where space is a premium.

Minimum Slew Rate: 75 V/us

This minimum slew rate indicates the ability to handle fast signal changes, improving response time in dynamic applications.

Maximum Supply Voltage Limit: 3 V

Preventing damage through defined voltage limits ensures operational safety within specified parameters.

Maximum Operating Temperature: 85 °C

Designed to operate in high-temperature environments, ideal for industrial applications.

Maximum Bias Current (IIB) @25°C: 12 uA

Low bias current increases efficiency and reduces power consumption, essential for battery-operated devices.

Frequency Compensation: YES

Built-in frequency compensation enhances stability across various operating conditions.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it suited for harsh environments, ensuring reliability in diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and corrosion resistance for long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and layout flexibility in circuit design.

Maximum Seated Height: 1.75 mm

A low seated height facilitates dense PCB designs, maximizing space efficiency.

Width: 3.9 mm

A compact width helps in fitting into tight spaces, advantageous for miniaturized devices.

Micropower: YES

Micropower capability is perfect for low-energy applications, extending battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures compatibility with standard PCB manufacturing processes, maintaining product integrity.

Peak Reflow Temperature °C: 260

A high reflow temperature indicates the product can withstand various manufacturing processes without degradation.

Length: 4.9 mm

Compact length allows for efficient layout in space-constrained designs, beneficial for modern electronics.

Temperature Grade: INDUSTRIAL

Being industrial grade ensures reliability and performance in demanding environments, suitable for various industrial applications.

Maximum Negative Supply Voltage Limit: -3 V

Strict limits on negative supply voltage reinforce device safety and operational reliability.

Terminal Form: GULL WING

The gull wing terminal form is standard for surface mount devices, ensuring easy and secure soldering.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it's versatile for various applications, including signal conditioning and filtering.

Maximum Supply Current: 0.53 mA

Low supply current promotes energy efficiency, making it an excellent choice for battery-powered systems.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Allows for balanced operation in dual-supply configurations, enhancing performance in analog applications.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture offers better bandwidth and transient response, improving performance in high-frequency applications.

Packing Method: TAPE AND REEL

Tape and reel packing is ideal for automated assembly processes, increasing manufacturing efficiency.

Nominal Slow Rate: 115 V/us

A higher nominal slew rate allows for handling of rapid transients, ideal for fast signal processing applications.

Terminal Pitch: 1.27 mm

The standard pitch facilitates compatibility with various PCB designs, simplifying integration.

Wideband: YES

Being wideband enables the amplifier to operate effectively across a broad range of frequencies, enhancing versatility.

Technical Specifications

Operational Amplifiers (Op Amps) TSH310IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Power Supply:

±2.5/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

61 dB

Input Offset Voltage Limit:

6500 uV

Minimum Slew Rate:

75 V/us

Nominal Slew Rate:

115 V/us

Maximum Bias Current (IIB) @25 °C:

12 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

530 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH310IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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