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TSH350IDT

STMicroelectronics

TSH350IDT by STMicroelectronics

TSH350IDT by STMicroelectronics is a high-performance operational amplifier featuring a max input offset voltage of 4000 µV, a common mode reject ratio of 58 dB, and operates within -40 °C to 85 °C. Ideal for industrial applications, it supports dual supply voltages of ±5 V. Its compact design and wide bandwidth make it suitable for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,472 parts In-Stock

1+ parts

-

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4,472

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Zilex Electronics Inc.

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

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Anansix

USA . 2,146 parts In-Stock

1+ parts

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2,146

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Digiode

USA . 407 parts In-Stock

1+ parts

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407

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

$0.864

10k+ parts

-

1,517

$0.960

-

$0.864

-

MKK Technologies

India . 2,298 parts In-Stock

1+ parts

$1.804

100+ parts

-

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2,298

$1.804

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DigiPath Technology Company

USA . 2,298 parts In-Stock

1+ parts

$1.804

100+ parts

-

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2,298

$1.804

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AZTECH Wire

Italy . 1,195 parts In-Stock

1+ parts

$14.680

100+ parts

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1,195

$14.680

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Microchip USA

USA . 5,406 parts In-Stock

1+ parts

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5,406

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Corphita

USA . 2,739 parts In-Stock

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2,739

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Vigor

Singapore . 2,162 parts In-Stock

1+ parts

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2,162

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

-

100+ parts

$1.147

1k+ parts

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1,586

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$1.147

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Overview

Unlock superior performance with the TSH350IDT operational amplifier from STMicroelectronics. Renowned for its exceptional quality and reliability, this compact powerhouse ensures precision in diverse applications—from industrial automation to audio systems. With a robust design suitable for extreme conditions and low power consumption, it promises efficiency without compromise. Elevate your projects with the TSH350IDT and experience the benefits of innovation backed by a trusted leader in technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various applications.

Maximum Input Offset Voltage: 4000 uV

A low input offset voltage enhances precision in operational amplifier applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular package provides optimal space utilization in PCB layouts.

Nominal Common Mode Reject Ratio: 58 dB

A high common mode reject ratio improves the amplifier's ability to reject noise and interference.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at 2.5 V makes it suitable for low-voltage applications, enhancing power efficiency.

Power Supplies (V): +-5

Dual power supply operation allows flexibility in circuit design for various applications.

No. of Terminals: 8

Eight terminals facilitate multiple connections and functions, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

A small outline package saves PCB space, making it ideal for compact electronics.

Maximum Supply Voltage Limit: 3 V

Limits the supply voltage to ensure safe operation and protect the device from damage.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C means it can perform reliably in various environmental conditions.

Maximum Bias Current (IIB) @25°C: 28 uA

A low bias current minimizes power consumption and extends the battery life in portable applications.

Frequency Compensation: YES

Built-in frequency compensation enhances stability, making it suitable for high-frequency applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes it reliable in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for efficient routing of input and output signals.

Maximum Seated Height: 1.75 mm

A low seated height helps in achieving a slim design profile in devices.

Width: 3.9 mm

A compact width supports high-density design requirements in modern PCBs.

Maximum Time At Peak Reflow Temperature (s): 40

Extended reflow time helps ensure reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

High reflow temperatures support compatibility with lead-free soldering processes.

Length: 4.9 mm

The short length accommodates tight spacing in compact circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring robustness and long-term reliability.

Maximum Negative Supply Voltage Limit: -3 V

Defines a safe operational boundary for negative supply voltage, preventing circuit damage.

Nominal Unity Gain Bandwidth: 65000 kHz

A high unity gain bandwidth allows for high-speed signal processing and wide application use.

Technology: BIPOLAR

Bipolar technology provides better performance in terms of speed and output drive capability.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering characteristics and ease of PCB assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier configuration makes it versatile for various signal processing tasks.

Maximum Supply Current: 4.9 mA

A low supply current contributes to energy efficiency, crucial for battery-operated devices.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Enables operations with a negative supply for varied application capabilities.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture allows for high-speed performance while maintaining signal integrity.

Packing Method: TAPE AND REEL

Tape and reel packaging ensures efficient handling and automated assembly processes.

Nominal Slow Rate: 940 V/us

A high slew rate means it can accurately follow fast-changing signals, enhancing performance.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch is standard for many designs, facilitating easy integration into PCBs.

Wideband: YES

Wideband capabilities indicate suitability for high-frequency applications where performance matters.

Technical Specifications

Operational Amplifiers (Op Amps) TSH350IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

65 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

58 dB

Input Offset Voltage Limit:

4000 uV

Nominal Slew Rate:

940 V/us

Maximum Bias Current (IIB) @25 °C:

28 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

4.9 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH350IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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