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TSH300IDT

STMicroelectronics

TSH300IDT by STMicroelectronics

TSH300IDT by STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 1800 µV, a common mode reject ratio of 83 dB, and a min slew rate of 160 V/µs. Ideal for industrial applications, it operates within -40 °C to 85 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$0.322

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 265 parts In-Stock

1+ parts

$0.438

100+ parts

$0.260

1k+ parts

$0.216

10k+ parts

-

265

$0.438

$0.260

$0.216

-

DigiKey

USA . 2,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.306

2,530

-

-

-

$1.306

Verical

USA . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.056

10k+ parts

-

416

-

-

$0.056

-

Chip1Stop

Japan . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.207

10k+ parts

-

275

-

-

$0.207

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,918 parts In-Stock

1+ parts

$0.056

100+ parts

-

1k+ parts

-

10k+ parts

-

3,918

$0.056

-

-

-

Digiode

USA . 4,620 parts In-Stock

1+ parts

$0.416

100+ parts

-

1k+ parts

-

10k+ parts

-

4,620

$0.416

-

-

-

Anansix

USA . 247 parts In-Stock

1+ parts

-

100+ parts

-

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247

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,872 parts In-Stock

1+ parts

$0.394

100+ parts

-

1k+ parts

-

10k+ parts

-

4,872

$0.394

-

-

-

IDEA Electronic Components Group

UK . 261 parts In-Stock

1+ parts

$2.149

100+ parts

-

1k+ parts

$1.934

10k+ parts

-

261

$2.149

-

$1.934

-

Vigor

Singapore . 1,057 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

$2.770

-

-

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MKK Technologies

India . 179 parts In-Stock

1+ parts

$4.041

100+ parts

-

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-

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179

$4.041

-

-

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DigiPath Technology Company

USA . 179 parts In-Stock

1+ parts

$4.041

100+ parts

-

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-

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179

$4.041

-

-

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Microchip USA

USA . 190 parts In-Stock

1+ parts

$9.034

100+ parts

-

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190

$9.034

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-

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Perfect Parts

USA . 3,892 parts In-Stock

1+ parts

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3,892

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Parana Technologies

USA . 1,798 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

-

10k+ parts

-

1,798

-

$2.570

-

-

Overview

Experience precision and reliability with the TSH300IDT operational amplifier from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robust performance across diverse applications—from industrial automation to consumer electronics—this compact and efficient Op Amp delivers exceptional voltage gain and low offset voltage, ensuring optimal signal integrity. Trust in STMicroelectronics’ commitment to quality and advancement for unmatched value in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability in various environments, making it suitable for a range of applications.

Maximum Input Offset Voltage: 1800 uV

A lower input offset voltage enhances precision, making this Op Amp ideal for applications requiring high accuracy in signal amplification.

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCBs, facilitating compact and lightweight electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and space on circuit boards, which is beneficial for high-density designs.

Nominal Common Mode Reject Ratio: 83 dB

A high common mode reject ratio improves noise rejection, making this amplifier suitable for precision applications in noisy environments.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V allows for lower power consumption, making it an energy-efficient choice for battery-operated devices.

Power Supplies (V): +-2.5

Flexible power supply requirements ensure compatibility with a wide range of systems, enhancing design versatility.

No. of Terminals: 8

Having 8 terminals facilitates multiple configurations and connections, enhancing functionality in versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact systems where space is at a premium, allowing for streamlined circuitry.

Minimum Slew Rate: 160 V/us

A higher slew rate allows the amplifier to respond quickly to fast-changing signals, making it suitable for high-speed applications.

Maximum Supply Voltage Limit: 3 V

The supply voltage limit ensures safe operation under specified conditions, preventing damage and ensuring reliability.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes this Op Amp suitable for industrial applications where temperature fluctuations may occur.

Maximum Bias Current (IIB) @25°C: 46 uA

A low bias current minimizes errors and enhances precision, making this Op Amp a great choice for sensitive applications.

Frequency Compensation: YES

Built-in frequency compensation helps in maintaining stability across a wide range of frequencies, enhancing performance without external components.

Minimum Voltage Gain: 1780

A high minimum voltage gain indicates strong amplification capabilities, making it suitable for signal conditioning applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for use in extreme conditions, making it suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and prevents oxidation, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions accommodate different circuit layouts, providing design flexibility for engineers.

Maximum Seated Height: 1.75 mm

A low seated height fits well in compact designs, allowing for thinner and lighter electronic devices.

Width: 3.9 mm

Narrow width facilitates placement in dense PCB layouts, essential for modern multicomponent boards.

Maximum Time At Peak Reflow Temperature (s): 40

The specified reflow time is compliant with standard manufacturing processes, ensuring ease of integration in production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering processes, enhancing reliability in the manufacturing stage.

Length: 4.9 mm

Short length aids in minimizing board space and allows for more components in compact designs, key in modern electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh environments, making it suitable for demanding applications.

Maximum Negative Supply Voltage Limit: -3 V

The negative supply voltage limit maintains operational safety while offering flexibility in connection configurations.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength during soldering, ensuring reliable attachment to PCBs.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile and can be used in a multitude of applications, from signal processing to filtering.

Maximum Supply Current: 19.5 mA

Controlled current consumption helps in maximizing battery life in portable applications without sacrificing performance.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Providing a negative supply voltage enhances operational flexibility, allowing for bipolar signaling or dual-supply operations.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture is known for robustness and stability in various feedback configurations, making it a reliable choice.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly processes, improving manufacturing efficiency and speed.

Nominal Slow Rate: 230 V/us

A high nominal slow rate offers a good balance for various applications, enhancing performance without excessive power consumption.

Terminal Pitch: 1.27 mm

The standardized terminal pitch allows for compatibility with most automated assembly systems, ensuring easy integration into existing designs.

Wideband: YES

Being wideband improves performance across a broad frequency range, making it suitable for high-fidelity applications.

Technical Specifications

Operational Amplifiers (Op Amps) TSH300IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

±2.5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Input Offset Voltage Limit:

1800 uV

Minimum Voltage Gain:

1780

Minimum Slew Rate:

160 V/us

Nominal Slew Rate:

230 V/us

Maximum Bias Current (IIB) @25 °C:

46 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

19.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH300IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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