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TSH330ID

STMicroelectronics

TSH330ID by STMicroelectronics

TSH330ID by STMicroelectronics is a wideband operational amplifier with a max input offset voltage of 7 mV and a common mode reject ratio of 54 dB. It operates within -40 °C to 85 °C, making it ideal for industrial applications. This compact, surface-mount device supports dual supply voltages of ±2.5/5 V.

Median Price

-

Lifecycle Status

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3

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1k+

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Vyrian

USA . 8,591 parts In-Stock

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8,591

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Anansix

USA . 627 parts In-Stock

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627

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Digiode

USA . 95 parts In-Stock

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95

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Microchip USA

USA . 391 parts In-Stock

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$4.056

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391

$4.056

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IDEA Electronic Components Group

UK . 1,392 parts In-Stock

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$5.769

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$5.192

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$5.769

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$5.192

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AZTECH Wire

Italy . 590 parts In-Stock

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$8.010

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590

$8.010

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MKK Technologies

India . 938 parts In-Stock

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$10.849

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938

$10.849

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DigiPath Technology Company

USA . 938 parts In-Stock

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$10.849

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938

$10.849

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QUARKTWIN TECHNOLOGY LTD

USA . 26,037 parts In-Stock

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Parana Technologies

USA . 2,350 parts In-Stock

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$6.898

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$6.898

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Vigor

Singapore . 2,182 parts In-Stock

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Corphita

USA . 351 parts In-Stock

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Overview

Unlock unparalleled performance with the TSH330ID operational amplifier from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers this compact solution that thrives in industrial applications, offering remarkable reliability and efficiency under extreme conditions. With superior noise rejection and low offset voltage, the TSH330ID empowers your designs to achieve precision and clarity, enhancing audio processing, signal conditioning, and sensor interfacing. Elevate your projects with a trusted partner known for innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the operational amplifier, making it suitable for various applications.

Maximum Input Offset Voltage: 7000 uV

A low input offset voltage is crucial for precision applications, ensuring accurate signal processing without significant errors.

Surface Mount: YES

The surface mount design allows for more compact circuit board layouts and is ideal for automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape provides a consistent and compact footprint for easy integration into diverse applications.

Nominal Common Mode Reject Ratio: 54 dB

A high common mode reject ratio improves the performance in noisy environments, making this op-amp suitable for sensitive applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V allows for low-power operation, making it energy-efficient for battery-powered applications.

Power Supplies (V): +-2.5/5

The dual power supply capability enables flexibility in circuit design, accommodating a variety of input voltage configurations.

No. of Terminals: 8

The 8-terminal design provides sufficient connectivity for versatile configurations and ease of integration in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package saves board space, making it ideal for compact electronic devices.

Maximum Supply Voltage Limit: 3 V

The maximum supply voltage limit of 3V ensures that the op-amp can be used in applications with restricted voltage supply.

Maximum Operating Temperature: 85 °C

The operational temperature range up to 85 °C allows the op-amp to be used in a wide range of industrial environments without performance degradation.

Maximum Bias Current (IIB) @25°C: 55 uA

A low bias current of 55 µA ensures minimal impact on the input signal, making it suitable for high-impedance applications.

Frequency Compensation: YES

The presence of frequency compensation enables stable operation in high-frequency applications, improving reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C makes this op-amp ideal for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures good solderability and enhances the longevity of the connection in harsh environments.

Terminal Position: DUAL

Dual terminal positioning allows for easier PCB layout and flexibility in design integration.

Maximum Seated Height: 1.75 mm

A low profile height aids in compact designs, enabling the creation of thinner devices.

Width: 3.9 mm

The narrow width helps in space-saving layouts, making it perfect for miniaturized electronic applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures compatibility with standard surface-mount soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 260

A peak temperature tolerance of 260 °C means the device can withstand high-temperature soldering without damage.

Length: 4.9 mm

The compact length contributes to high density in circuit board layouts, vital for modern electronics.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this op-amp offers enhanced reliability and performance under demanding conditions.

Maximum Negative Supply Voltage Limit: -3 V

The ability to handle negative supply voltages makes this op-amp versatile for various signal processing applications.

Technology: BIPOLAR

Bipolar technology provides superior performance characteristics such as faster switching speeds and better linearity.

Terminal Form: GULL WING

The gull-wing terminal design simplifies soldering and improves mechanical stability on circuit boards.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are essential components in analog signal processing, making this product suitable for countless circuit applications.

Maximum Supply Current: 20.2 mA

A maximum supply current of 20.2 mA allows for robust performance in driving larger loads without significant power loss.

Nominal Negative Supply Voltage (Vsup): -2.5 V

The nominal negative supply voltage of -2.5V provides versatility in differential signaling applications.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture enhances bandwidth and slew rate, making this op-amp suitable for high-speed applications.

Packing Method: TUBE

The tube packing method facilitates easy handling and assures that components are delivered in pristine condition.

Nominal Slow Rate: 1800 V/us

A high slew rate of 1800 V/µs allows for quick response times, making it ideal for fast-changing signals.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm is compatible with most PCB layouts, ensuring easy assembly and integration.

Wideband: YES

Wideband capability means the op-amp can operate effectively over a broad frequency range, suitable for high-frequency applications.

Technical Specifications

Operational Amplifiers (Op Amps) TSH330ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Power Supply:

±2.5/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

54 dB

Input Offset Voltage Limit:

7000 uV

Nominal Slew Rate:

1800 V/us

Maximum Bias Current (IIB) @25 °C:

55 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

20.2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH330ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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