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TSH350IQT

STMicroelectronics

TSH350IQT by STMicroelectronics

TSH350IQT by STMicroelectronics is a high-performance operational amplifier with a max input offset voltage of 4000 µV and a common mode reject ratio of 58 dB. It operates within -40 °C to 85 °C, making it ideal for industrial applications. Its compact design features an 8-terminal, very thin profile suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,401 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,401

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-

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Vyrian

USA . 2,863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,863

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Anansix

USA . 664 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,790 parts In-Stock

1+ parts

$4.249

100+ parts

-

1k+ parts

$3.825

10k+ parts

-

1,790

$4.249

-

$3.825

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MKK Technologies

India . 1,588 parts In-Stock

1+ parts

$7.991

100+ parts

-

1k+ parts

-

10k+ parts

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1,588

$7.991

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DigiPath Technology Company

USA . 1,588 parts In-Stock

1+ parts

$7.991

100+ parts

-

1k+ parts

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10k+ parts

-

1,588

$7.991

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-

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Corphita

USA . 1,228 parts In-Stock

1+ parts

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1,228

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Parana Technologies

USA . 839 parts In-Stock

1+ parts

-

100+ parts

$5.081

1k+ parts

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10k+ parts

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839

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$5.081

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Overview

Unlock exceptional performance with the TSH350IQT operational amplifier from STMicroelectronics. Renowned for its reliability and innovation, STMicroelectronics delivers a versatile solution perfectly suited for industrial applications demanding precision and durability. With its compact design and superior common mode rejection, the TSH350IQT enhances signal integrity while saving precious board space. Elevate your projects with unmatched quality and efficiency, ensuring your systems operate flawlessly in any environment.

Feature Benefit Bullets

Maximum Input Offset Voltage: 4000 uV

A low input offset voltage ensures accurate signal amplification, making this operational amplifier suitable for precision applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, facilitating high-density applications and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a stable footprint for circuit design, enhancing overall performance in tight spaces.

Nominal Common Mode Reject Ratio: 58 dB

A high common mode reject ratio enhances the amplifier's ability to reject noise and interference, ensuring high signal integrity.

Nominal Supply Voltage / Vsup: 2.5 V

Low supply voltage operation is beneficial for battery-powered applications, promoting energy efficiency.

No. of Terminals: 8

An 8-terminal configuration offers flexibility in circuit design while supporting robust performance.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile aid in compact designs while allowing for efficient heat dissipation.

Maximum Supply Voltage Limit: 3 V

A maximum supply voltage of 3 V is suitable for low-voltage applications, ensuring compatibility with a variety of devices.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C makes this product reliable for industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C expands application potential to extreme environments, ensuring reliability in harsh conditions.

Terminal Finish: MATTE TIN

A matte tin terminal finish enhances corrosion resistance and solderability, contributing to longer product lifespan.

Terminal Position: DUAL

Dual terminal positioning allows for versatile circuit configurations, improving layout convenience.

Maximum Seated Height: 1 mm

With a low seated height, this operational amplifier is ideal for space-constrained applications without compromising performance.

Width: 3 mm

A compact width of 3 mm makes this component suitable for high-density integration into various electronic devices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, promoting ease of manufacturing.

Peak Reflow Temperature: 260 °C

A peak reflow temperature tolerance of 260 °C ensures reliability during thermal processes, protecting the integrity of the component.

Length: 3 mm

The 3 mm length is ideal for compact designs, allowing for efficient space utilization on PCBs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees high performance and robust operation under varied environmental conditions.

Maximum Negative Supply Voltage Limit: -3 V

Support for a maximum negative supply voltage of -3V makes this op-amp versatile, allowing it to accommodate various operational requirements.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Operating with a nominal negative supply voltage of -2.5V allows for a wider range of input signal handling.

Nominal Unity Gain Bandwidth: 65000 kHz

A nominal unity gain bandwidth of 65 MHz ensures high-speed performance, suitable for applications requiring rapid signal processing.

Nominal Slow Rate: 940 V/us

A high slew rate of 940 V/µs enables the amplifier to respond quickly to input signal changes, making it ideal for fast signal processing applications.

Terminal Form: NO LEAD

No-lead terminal design minimizes PCB space usage and enhances electrical performance due to shortened lead lengths.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density designs, making it suitable for modern compact electronic circuits.

Technical Specifications

Operational Amplifiers (Op Amps) TSH350IQT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

65 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

58 dB

Input Offset Voltage Limit:

4000 uV

Nominal Slew Rate:

940 V/us

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Very Thin Profile

Trade Compliance

TSH350IQT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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