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TSH310ID

STMicroelectronics

TSH310ID by STMicroelectronics

TSH310ID by STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 6500 µV and a common mode reject ratio of 61 dB. It operates within -40 °C to 85 °C, making it ideal for industrial applications. With a compact SO package, it supports surface mount technology for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,594 parts In-Stock

1+ parts

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4,594

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Anansix

USA . 2,713 parts In-Stock

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2,713

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Digiode

USA . 1,165 parts In-Stock

1+ parts

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1,165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$4.107

100+ parts

-

1k+ parts

$3.696

10k+ parts

-

1,940

$4.107

-

$3.696

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MKK Technologies

India . 2,110 parts In-Stock

1+ parts

$7.723

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-

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2,110

$7.723

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DigiPath Technology Company

USA . 2,110 parts In-Stock

1+ parts

$7.723

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-

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10k+ parts

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2,110

$7.723

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AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$9.030

100+ parts

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239

$9.030

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Microchip USA

USA . 308 parts In-Stock

1+ parts

$16.611

100+ parts

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308

$16.611

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Vigor

Singapore . 6,826 parts In-Stock

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6,826

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A-Z Elektronik GmbH

Germany . 5,490 parts In-Stock

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5,490

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Corphita

USA . 4,323 parts In-Stock

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4,323

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Parana Technologies

USA . 434 parts In-Stock

1+ parts

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100+ parts

$4.910

1k+ parts

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434

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$4.910

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Overview

Elevate your design with the TSH310ID from STMicroelectronics, a trusted leader in innovation. This operational amplifier delivers superior performance with low power consumption and robust temperature stability, making it ideal for industrial applications. Experience unparalleled precision and reliability while benefiting from ST's commitment to quality and support. Choose TSH310ID for enhanced signal integrity and efficiency, ensuring your projects excel in any environment!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage allows for better accuracy and precision in signal amplification, making it ideal for sensitive applications.

Surface Mount: YES

Surface mount technology enables compact designs and easier assembly, which is crucial for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB space and facilitates easy placement on circuit boards.

Nominal Common Mode Reject Ratio: 61 dB

A high common mode reject ratio ensures that the op-amp is effective in rejecting noise and interference, enhancing signal integrity.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage of 2.5 V allows for energy-efficient performance, which is particularly beneficial for battery-powered applications.

Power Supplies (V): +-2.5/5

Supports both positive and negative supplies, making it versatile for different circuit configurations and applications.

No. of Terminals: 8

With 8 terminals, this op-amp can be easily integrated into various circuits while offering enough connection points for functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package reduces the footprint on PCBs, facilitating high-density circuit designs.

Minimum Slew Rate: 75 V/us

A minimum slew rate of 75 V/us provides fast response times, which is crucial for high-frequency applications.

Maximum Supply Voltage Limit: 3 V

This provides flexibility in use while ensuring safety against overvoltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for industrial applications where higher temperatures are common.

Maximum Bias Current (IIB) @25°C: 12 uA

A low bias current minimizes errors in precision circuits, making this op-amp suitable for high-accuracy applications.

Frequency Compensation: YES

In-built frequency compensation enhances stability during operation across a wide range of frequencies.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes it suitable for use in harsh environments, such as automotive and industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures reliable connectivity and durability, enhancing performance in demanding applications.

Terminal Position: DUAL

A dual terminal position allows for more versatile applications and easier circuit design.

Maximum Seated Height: 1.75 mm

A low seated height allows for better integration into compact designs and helps with overall product miniaturization.

Width: 3.9 mm

A narrow width is beneficial for high-density PCB layouts and makes it easier to work with in tight spaces.

Micropower: YES

Being a micropower device, this op-amp consumes minimal power, making it ideal for low-energy applications.

Maximum Time At Peak Reflow Temperature (s): 40

A longer time at peak reflow temperature allows for adequate soldering without damaging the component, ensuring reliable manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the op-amp can withstand the soldering process during assembly.

Length: 4.9 mm

A compact length aids in design flexibility and allows for space-efficient circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in demanding environments and applications.

Maximum Negative Supply Voltage Limit: -3 V

The negative supply voltage capability enhances the versatility of this op-amp for both single and dual supply configurations.

Terminal Form: GULL WING

The gull wing terminal form ensures effective soldering and reliability in assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

This product is a robust operational amplifier suitable for a wide range of applications, from signal processing to control systems.

Maximum Supply Current: 0.53 mA

A low maximum supply current means reduced power consumption, which is especially crucial in battery-operated devices.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Supports a nominal negative supply voltage, enhancing its utility in various application designs.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture allows for high bandwidth and fast response, making it suitable for audio and RF applications.

Packing Method: TUBE

Packed in tubes, this method is efficient for transportation and facilitates easy handling during assembly.

Nominal Slow Rate: 115 V/us

A nominal slow rate indicates a decent response capability for moderate-speed applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for standard interfacing with other components on a PCB, promoting design compatibility.

Wideband: YES

The wideband capability makes this op-amp suitable for high-frequency applications, providing flexibility in design.

Technical Specifications

Operational Amplifiers (Op Amps) TSH310ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Power Supply:

±2.5/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

61 dB

Input Offset Voltage Limit:

6500 uV

Minimum Slew Rate:

75 V/us

Nominal Slew Rate:

115 V/us

Maximum Bias Current (IIB) @25 °C:

12 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

3 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-3 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

530 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH310ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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