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TDE1897RDP

STMicroelectronics

TDE1897RDP by STMicroelectronics

TDE1897RDP by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 35V and built-in protections against overcurrent, thermal issues, and undervoltage. It operates efficiently in temperatures from -25 °C to 85°C, making it ideal for various applications. With an output current of up to 0.625A, it's perfect for buffer or inverter-based systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,945 parts In-Stock

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5,945

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Anansix

USA . 1,140 parts In-Stock

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1,140

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Digiode

USA . 242 parts In-Stock

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242

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Sogenti Electronics

Canada . 21 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 220 parts In-Stock

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$2.063

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220

$2.063

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IDEA Electronic Components Group

UK . 1,562 parts In-Stock

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$5.526

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$4.973

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$5.526

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$4.973

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MKK Technologies

India . 410 parts In-Stock

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$10.390

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410

$10.390

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DigiPath Technology Company

USA . 410 parts In-Stock

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$10.390

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410

$10.390

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AZTECH Wire

Italy . 278 parts In-Stock

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$20.960

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278

$20.960

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QUARKTWIN TECHNOLOGY LTD

USA . 6,487 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,629 parts In-Stock

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Parana Technologies

USA . 1,010 parts In-Stock

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$6.607

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 599 parts In-Stock

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Kepictronics

USA . 70 parts In-Stock

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Overview

Unlock superior performance with the TDE1897RDP from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This reliable peripheral driver excels across diverse applications, offering robust features like built-in overcurrent and thermal protections for enhanced safety. With a wide operating voltage range and rapid response times, it ensures seamless integration and efficiency, empowering your designs to achieve their full potential while delivering exceptional value you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and protection against environmental factors.

Maximum Supply Voltage: 35 V

With a maximum supply voltage of 35 V, this driver is suitable for a wide range of applications, offering flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape facilitates compact and organized assembly on circuit boards.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protection features enhance reliability and safeguard against common electrical faults.

Power Supplies: 18/35 V

Support for both 18 V and 35 V power supplies allows for versatile usage in various peripheral applications.

No. of Terminals: 8

Eight terminals provide ample connectivity options, facilitating easy integration into different systems.

Package Style: IN-LINE

The in-line package style simplifies layout and connection in PCB designs, saving space.

Minimum Supply Voltage: 18 V

A minimum supply voltage of 18 V is ideal for maintaining consistent performance across loads.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C allows this driver to perform reliably in demanding environments.

Minimum Operating Temperature: -25 °C

With a minimum temperature rating of -25 °C, this product is suitable for low-temperature applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and offers corrosion resistance, ensuring strong electrical connections.

Terminal Position: DUAL

Dual terminal position enables flexible connections, catering to various placement requirements on PCBs.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm contributes to a compact design, perfect for space-constrained applications.

Width: 7.62 mm

The width of 7.62 mm allows for efficient use of PCB space, making it easier to arrange components.

Temperature Grade: COMMERCIAL EXTENDED

Rated for commercial extended temperatures, this driver can be used in various standard environments.

Maximum Output Current: 0.625 A

The capability to handle a maximum output current of 0.625 A makes this product suitable for common peripheral devices.

Technology: BCDMOS

The BCDMOS technology enhances performance by integrating both analog and digital functions efficiently.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical strength and offers ease of assembly in various setups.

Nominal Supply Voltage: 24 V

Optimized for a nominal supply voltage of 24 V, making it ideal for many peripheral driver applications.

Turn-on Time: 100 μs

Quick turn-on time of 100 μs ensures fast response, which is crucial for dynamic applications.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm makes the integration with existing circuits straightforward.

Nominal Output Peak Current Limit: 0.75 A

The ability to handle a nominal output peak current limit of 0.75 A provides additional capability for transient loads.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed for interfacing with buffers or inverters, this product offers flexibility in circuit design.

Turn-off Time: 20 μs

Fast turn-off time of 20 μs allows for quick disconnection, which is important for timing-sensitive applications.

Output Current Flow Direction: SINK

The ability to sink current makes this driver ideal for controlling loads like LEDs and relays.

Technical Specifications

Peripheral Drivers TDE1897RDP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.625 A

Nominal Output Peak Current Limit:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.35

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

18/35

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

18 V

Nominal Supply Voltage:

24 V

Maximum Supply Voltage-1:

35 V

Minimum Supply Voltage-1:

9 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

20 us

Turn-on Time:

100 us

Width:

7.62 mm

Trade Compliance

TDE1897RDP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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