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TDE1897CDP

STMicroelectronics

TDE1897CDP by STMicroelectronics

TDE1897CDP by STMicroelectronics is a peripheral driver with a max supply voltage of 35V and built-in protections for over current, thermal, and under voltage. It operates within a temperature range of -25 to 85°C and has a nominal output peak current limit of 0.75A. This interface IC type is commonly used in applications requiring buffer or inverter based peripheral drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,408 parts In-Stock

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5,408

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Anansix

USA . 1,279 parts In-Stock

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1,279

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Digiode

USA . 713 parts In-Stock

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713

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$2.768

100+ parts

-

1k+ parts

$2.491

10k+ parts

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1,816

$2.768

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$2.491

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Corohmni

South Africa . 775 parts In-Stock

1+ parts

$3.424

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775

$3.424

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MKK Technologies

India . 1,710 parts In-Stock

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$5.206

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1,710

$5.206

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DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

$5.206

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1,710

$5.206

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Microchip USA

USA . 394 parts In-Stock

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$5.784

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394

$5.784

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$6.500

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254

$6.500

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Aztec Data Supply Inc.

USA . 3,179 parts In-Stock

1+ parts

$8.142

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3,179

$8.142

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AZTECH Wire

Italy . 856 parts In-Stock

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$13.131

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856

$13.131

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Argo Parts USA

USA . 3,844 parts In-Stock

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3,844

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Parana Technologies

USA . 752 parts In-Stock

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$3.310

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752

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$3.310

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Corphita

USA . 485 parts In-Stock

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485

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Continental Prestige Electronics

USA . 302 parts In-Stock

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302

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Aranea Global

USA . 50 parts In-Stock

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50

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Assy Fe

Spain . 2 parts In-Stock

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2

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Overview

Enhance your electronic projects with the TDE1897CDP from STMicroelectronics, a leading manufacturer known for their high-quality components. This peripheral driver offers built-in protections against over current, thermal issues, and under voltage, ensuring reliable performance. With a wide operating temperature range and versatile power supplies, this product is perfect for a variety of applications. Trust STMicroelectronics to deliver value, benefits, and advantages to customers looking for top-notch solutions in the electronics industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable applications.

Maximum Supply Voltage: 35 V

The high maximum supply voltage allows for versatility in powering various peripheral devices, accommodating a wide range of voltage requirements.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of connected devices by safeguarding against potential damage from overcurrent, overheating, and undervoltage situations.

Maximum Output Current: 0.625 A

The high maximum output current capability allows for driving power-hungry peripherals without the risk of overload or malfunction.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability even in high-temperature environments, making the product suitable for a wide range of applications.

Technical Specifications

Peripheral Drivers TDE1897CDP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.625 A

Nominal Output Peak Current Limit:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.35

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

18/35

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

18 V

Nominal Supply Voltage:

24 V

Maximum Supply Voltage-1:

35 V

Minimum Supply Voltage-1:

9 V

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

20 us

Turn-on Time:

100 us

Width:

7.62 mm

Trade Compliance

TDE1897CDP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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