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TDE1647ACM

STMicroelectronics

TDE1647ACM by STMicroelectronics

TDE1647ACM by STMicroelectronics is a peripheral driver with a max supply voltage of 45V and built-in protections for over current and thermal issues. It operates b/w -25 to 85 °C, has a nominal output peak current limit of 0.3A, and is suitable for applications requiring buffer or inverter based peripheral drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

-

-

-

-

Vyrian

USA . 1,278 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,278

-

-

-

-

Anansix

USA . 459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

459

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 24 parts In-Stock

1+ parts

$4.117

100+ parts

-

1k+ parts

$3.705

10k+ parts

-

24

$4.117

-

$3.705

-

MKK Technologies

India . 2,254 parts In-Stock

1+ parts

$7.742

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$7.742

-

-

-

DigiPath Technology Company

USA . 2,254 parts In-Stock

1+ parts

$7.742

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$7.742

-

-

-

Corphita

USA . 2,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,595

-

-

-

-

Parana Technologies

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

$4.922

1k+ parts

-

10k+ parts

-

2,200

-

$4.922

-

-

Overview

Experience the superior quality and reliability of STMicroelectronics with the TDE1647ACM peripheral driver. This versatile device offers built-in protections against over current and thermal issues, ensuring safe and efficient operation. With a wide supply voltage range and high output current capability, this product is ideal for a variety of applications. Trust STMicroelectronics to deliver cutting-edge technology and unmatched performance for all your driver needs. Unlock new possibilities with the TDE1647ACM and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and better heat dissipation, ensuring reliability and longevity of the product.

Maximum Supply Voltage: 45 V

Support for high supply voltage allows for versatile use in different applications, providing flexibility and compatibility.

Package Shape: ROUND

Round package shape allows for easy installation and integration into various systems, making it user-friendly.

Built-in Protections: OVER CURRENT; THERMAL

Built-in protections for over current and thermal issues enhance safety and protect the product and connected components from damage.

Power Supplies (V): 24

Stable power supply at 24 V ensures consistent performance and operation of the product.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for interfacing with other devices or systems.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables secure and stable mounting, reducing the risk of disconnection or damage.

Minimum Supply Voltage: 8 V

Support for low minimum supply voltage allows for operation in a wide range of voltage levels, increasing versatility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance under varying environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature tolerance allows for use in cold environments without affecting functionality.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good conductivity and solderability for secure connections and reliable performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and connection to other components or circuitry.

Maximum Output Current: 0.3 A

Support for maximum output current of 0.3 A ensures sufficient power delivery for connected devices or components.

Technology: BIPOLAR

Bipolar technology offers high-performance characteristics and precise control for effective operation in various applications.

Terminal Form: WIRE

Wire terminal form provides flexibility in connection methods and ease of installation in different setups.

Nominal Supply Voltage: 24 V

Nominal supply voltage of 24 V ensures optimal performance and compatibility with standard voltage requirements.

Nominal Output Peak Current Limit: 0.3 A

Nominal output peak current limit of 0.3 A provides protection against excessive current flow, enhancing safety and reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based peripheral driver interface IC type offers compatibility with a wide range of systems and devices, increasing flexibility.

Output Current Flow Direction: SOURCE

Source output current flow direction ensures proper operation and delivery of power to connected devices or components.

Technical Specifications

Peripheral Drivers TDE1647ACM attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

O-MBFM-W6

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.3 A

Package Body Material:

METAL

Package Equivalence Code:

CAN6/8,.2

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

TDE1647ACM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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