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TDE1737FPT

STMicroelectronics

TDE1737FPT by STMicroelectronics

TDE1737FPT by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 45V and operates b/w -25 °C to 85°C. It features built-in overcurrent and thermal protections, making it ideal for reliable applications. This compact device supports up to 1A output current in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,861 parts In-Stock

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11,861

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Digiode

USA . 2,561 parts In-Stock

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2,561

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Digital Electronic Gebert Verwaltungs UG

Germany . 1,500 parts In-Stock

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1,500

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Anansix

USA . 396 parts In-Stock

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396

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,577 parts In-Stock

1+ parts

$9.075

100+ parts

-

1k+ parts

$8.167

10k+ parts

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1,577

$9.075

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$8.167

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Microchip USA

USA . 132 parts In-Stock

1+ parts

$9.498

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-

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132

$9.498

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AZTECH Wire

Italy . 578 parts In-Stock

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$13.430

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578

$13.430

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MKK Technologies

India . 11 parts In-Stock

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$17.065

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11

$17.065

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DigiPath Technology Company

USA . 11 parts In-Stock

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$17.065

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11

$17.065

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Component Stockers USA

USA . 204 parts In-Stock

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$99.990

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204

$99.990

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Parana Technologies

USA . 1,120 parts In-Stock

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$10.850

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1,120

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$10.850

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Corphita

USA . 595 parts In-Stock

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595

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Unlock the potential of your projects with the TDE1737FPT from STMicroelectronics, a leader in innovative peripheral drivers. Built for reliability and performance, this compact device ensures robust over-current and thermal protection, making it ideal for various applications from automation to consumer electronics. Enjoy peace of mind knowing that you’re backed by ST's commitment to quality, allowing you to focus on delivering exceptional results with increased efficiency and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and weather resistance, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and is ideal for modern PCB layouts, saving valuable space.

Maximum Supply Voltage: 45 V

A high maximum supply voltage provides flexibility for different applications and can often accommodate power surges.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for space utilization on PCBs, allowing for a more organized layout.

Built-in Protections: OVER CURRENT; THERMAL

Inbuilt over current and thermal protections enhance reliability and safety, preventing damage in extreme conditions.

Power Supplies (V): 24

The specification of 24V power supply is a common standard, ensuring compatibility with many existing systems.

No. of Terminals: 14

Having 14 terminals allows for more integration options and can handle multiple functions or connections efficiently.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes high-density mounting, which is ideal for compact electronic devices.

Minimum Supply Voltage: 8 V

A low minimum supply voltage broadens the range of applications and ensures functionality in varied environments.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature indicates reliability in hot environments, making it suitable for industrial applications.

Minimum Operating Temperature: -25 °C

A low minimum operating temperature allows the product to function effectively in cold climates, ensuring year-round usability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures excellent conductivity and reliability over time, reducing the risk of corrosion.

Terminal Position: DUAL

Dual terminal position provides flexibility in layout and connection options, making it easy to integrate into existing designs.

Maximum Seated Height: 1.75 mm

The low seated height is ideal for low-profile applications, maintaining a sleek design while optimizing space.

Width: 3.9 mm

A narrow width allows for compact configurations on PCBs, making it easier to design smaller, more efficient electronics.

Length: 8.65 mm

The reasonable length contributes to a balanced footprint on PCBs, aiding in efficient component layout.

Maximum Output Current: 1 A

A maximum output current of 1 A provides adequate power for various peripheral devices, making it versatile.

Technology: BIPOLAR

Using bipolar technology ensures high-speed switching and low power consumption, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals allow for easy solderability and handling, which is beneficial during assembly processes.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V reflects its strong compatibility with many standard systems in use today.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in compact designs, allowing for efficient space utilization on boards.

Nominal Output Peak Current Limit: 1 A

A nominal output peak current limit of 1 A ensures safe operation under high load conditions, providing added reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based peripheral driver, it provides essential signal handling, improving signal integrity and communication quality.

Output Current Flow Direction: SOURCE

Being a source type makes it suitable for driving loads directly, enhancing the efficiency of power delivery.

Technical Specifications

Peripheral Drivers TDE1737FPT attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDE1737FPT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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