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TDE1747DP

STMicroelectronics

TDE1747DP by STMicroelectronics

TDE1747DP by STMicroelectronics is a peripheral driver with 8 terminals and built-in protections for over current and thermal issues. It operates at supply voltages ranging from 8V to 24V, with a max output current of 0.3A. This rectangular package is ideal for applications requiring a source flow direction in buffer or inverter based interface ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,731 parts In-Stock

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6,731

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Digiode

USA . 3,863 parts In-Stock

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3,863

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Anansix

USA . 2,815 parts In-Stock

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2,815

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Digital Electronic Gebert Verwaltungs UG

Germany . 727 parts In-Stock

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727

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ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

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400

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Fibra_Brandt Electronic GMBH

Germany . 97 parts In-Stock

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97

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LIBRA Elektronik GmbH

Germany . 42 parts In-Stock

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42

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ECAB

Sweden . 38 parts In-Stock

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38

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Huijzer Components

Netherlands . 38 parts In-Stock

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J2 Sourcing AB

Sweden . 19 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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8

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Zilex Electronics Inc.

Canada . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

1+ parts

$3.500

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1,041

$3.500

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

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$7.215

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$6.493

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2,053

$7.215

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$6.493

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MKK Technologies

India . 647 parts In-Stock

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$13.567

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647

$13.567

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DigiPath Technology Company

USA . 647 parts In-Stock

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$13.567

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647

$13.567

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AZTECH Wire

Italy . 344 parts In-Stock

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$17.530

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$17.530

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QUARKTWIN TECHNOLOGY LTD

USA . 19,240 parts In-Stock

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Corphita

USA . 4,807 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,512 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 3,942 parts In-Stock

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3,942

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Parana Technologies

USA . 1,313 parts In-Stock

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$8.626

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$8.626

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Metaverse IC Inc.

Canada . 790 parts In-Stock

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790

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Assy Fe

Spain . 501 parts In-Stock

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Kepictronics

USA . 220 parts In-Stock

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Overview

Discover the ultimate solution for your peripheral driver needs with the TDE1747DP by STMicroelectronics. Crafted with precision and quality, this product offers unmatched reliability and performance. Whether you are looking to power up your industrial automation systems or enhance your automotive applications, this peripheral driver is the perfect fit. With built-in protections against overcurrent and thermal issues, you can trust that your devices are safe and secure. Experience the value and benefits of the TDE1747DP and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for easy handling and long-term usage.

Maximum Supply Voltage: 45 V

With a high maximum supply voltage of 45V, this peripheral driver can handle various power input requirements and provide flexibility in different applications.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections for over current and thermal conditions ensure the safety and reliability of the connected devices by preventing damage due to excess current or heat.

Power Supplies (V): 24

The 24V power supply capability allows compatibility with a wide range of devices that operate on this voltage, making it versatile for different electronic setups.

Maximum Output Current: 0.3 A

The high maximum output current of 0.3A enables this peripheral driver to effectively drive and control devices that require higher current levels.

Technology: BIPOLAR

The bipolar technology used in this product ensures stable and accurate signal processing, making it suitable for precision applications that require reliable performance.

Technical Specifications

Peripheral Drivers TDE1747DP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.48 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDE1747DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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