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TDE1647FP

STMicroelectronics

TDE1647FP by STMicroelectronics

STMicroelectronics TDE1647FP is a 14-terminal peripheral driver with max output current of 0.3A and nominal voltage of 24V. It operates b/w -25 °C to 85°C, suitable for various applications requiring bipolar technology and surface mount package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,945 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,945

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Digiode

USA . 1,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,764

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-

-

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Vyrian

USA . 1,235 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,235

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$6.579

100+ parts

-

1k+ parts

$5.921

10k+ parts

-

860

$6.579

-

$5.921

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MKK Technologies

India . 633 parts In-Stock

1+ parts

$12.371

100+ parts

-

1k+ parts

-

10k+ parts

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633

$12.371

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-

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DigiPath Technology Company

USA . 633 parts In-Stock

1+ parts

$12.371

100+ parts

-

1k+ parts

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10k+ parts

-

633

$12.371

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-

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Corphita

USA . 4,384 parts In-Stock

1+ parts

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100+ parts

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4,384

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Parana Technologies

USA . 86 parts In-Stock

1+ parts

-

100+ parts

$7.866

1k+ parts

-

10k+ parts

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86

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$7.866

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Overview

Experience the power and reliability of the TDE1647FP by STMicroelectronics, a top-of-the-line peripheral driver that delivers unparalleled performance and precision. Manufactured by industry leader STMicroelectronics, this cutting-edge product is designed for a wide range of applications, boasting a compact package body material and surface mount capabilities. With a nominal supply voltage of 24V and a maximum output current of 0.3A, the TDE1647FP offers customers unmatched value, benefits, and advantages. Upgrade your electronics with this innovative solution and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Power Supplies (V): 24

With a power supply of 24V, this product is compatible with a wide range of industrial applications.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and broad compatibility with different systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in tough environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature enables this product to function effectively in cold environments.

Maximum Output Current: 0.3 A

With a maximum output current of 0.3A, this product can handle moderate power requirements efficiently.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and ease of soldering during installation.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V ensures compatibility with standard power sources in industrial settings.

Technical Specifications

Peripheral Drivers TDE1647FP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDE1647FP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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