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TDE1737DP

STMicroelectronics

TDE1737DP by STMicroelectronics

TDE1737DP by STMicroelectronics is a peripheral driver with 8 terminals and built-in protections for over current and thermal issues. It operates b/w -25 to 85 °C, with a max supply voltage of 45 V and output current up to 1 A. Ideal for applications requiring buffer or inverter based peripheral drivers with a nominal voltage of 24 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ECAB

Sweden . 8,698 parts In-Stock

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8,698

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Vyrian

USA . 4,214 parts In-Stock

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4,214

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Digiode

USA . 2,542 parts In-Stock

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2,542

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Anansix

USA . 249 parts In-Stock

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249

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Infinite Electronics LLP

India . 139 parts In-Stock

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139

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

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50

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Zilex Electronics Inc.

Canada . 30 parts In-Stock

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30

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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14

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 167 parts In-Stock

1+ parts

$7.041

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167

$7.041

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$8.619

100+ parts

-

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$7.757

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961

$8.619

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$7.757

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MKK Technologies

India . 1,734 parts In-Stock

1+ parts

$16.207

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1,734

$16.207

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DigiPath Technology Company

USA . 1,734 parts In-Stock

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$16.207

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1,734

$16.207

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Ampacity Inc.

Singapore . 1,465 parts In-Stock

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$18.500

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$18.500

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Kepictronics

USA . 14,000 parts In-Stock

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14,000

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A-Z Elektronik GmbH

Germany . 6,203 parts In-Stock

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Perfect Parts

USA . 2,063 parts In-Stock

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Corphita

USA . 523 parts In-Stock

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523

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Assy Fe

Spain . 410 parts In-Stock

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410

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Parana Technologies

USA . 86 parts In-Stock

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$10.305

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$10.305

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iodParts Technologies Inc.

India . 14 parts In-Stock

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Overview

Upgrade your electronic designs with the TDE1737DP from STMicroelectronics, a leading manufacturer known for superior quality and reliability. As a peripheral driver, this versatile component offers built-in protections against overcurrent and thermal issues, ensuring long-term performance and peace of mind. With a maximum output current of 1A and a nominal supply voltage of 24V, the TDE1737DP is perfect for a wide range of applications. Trust STMicroelectronics to deliver innovative solutions that meet your needs, providing value, efficiency, and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term use in various conditions.

Maximum Supply Voltage: 45 V

With a high maximum supply voltage of 45 V, this peripheral driver can be used in a wide range of applications, providing flexibility in power source selection.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and integration within electronic circuits, saving space and improving overall system design.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues ensure the safe operation of connected components, reducing the risk of damage or malfunction.

Power Supplies (V): 24

With a nominal power supply of 24V, this peripheral driver is compatible with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 8

The multiple terminals provide connectivity options for various components, allowing for versatile configurations and expanded functionality.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and connection to other devices, ensuring a secure and stable setup in the system.

Minimum Supply Voltage: 8 V

With a low minimum supply voltage of 8V, this peripheral driver can operate efficiently even in low-power environments, enhancing its usability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enables the peripheral driver to withstand elevated temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C allows the peripheral driver to function reliably even in cold environments, expanding its range of applications.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals enhances connectivity and prevents corrosion, ensuring a stable and long-lasting electrical connection.

Terminal Position: DUAL

The dual terminal position provides flexibility in wiring and helps optimize signal transmission, contributing to improved performance and reliability.

Maximum Seated Height: 5.08 mm

The compact maximum seated height allows for space-efficient installation, making this peripheral driver suitable for applications with limited vertical clearance.

Width: 7.62 mm

The narrow width of 7.62mm enables easy integration into tight spaces and dense circuit layouts, enhancing the overall design flexibility.

Maximum Output Current: 1 A

With a maximum output current of 1A, this peripheral driver can effectively drive connected components, ensuring reliable performance under various load conditions.

Technology: BIPOLAR

The use of bipolar technology in this peripheral driver provides high switching speed and precise control, making it suitable for applications that require fast and accurate signal processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies soldering and ensures secure mechanical and electrical connections, improving the overall robustness of the installation.

Nominal Supply Voltage: 24 V

With a nominal supply voltage of 24V, this peripheral driver is compatible with standard power sources, ensuring easy integration and consistent performance.

Terminal Pitch: 2.54 mm

The narrow terminal pitch of 2.54mm facilitates compact circuit board layout and assembly, optimizing the overall space utilization and system efficiency.

Nominal Output Peak Current Limit: 0.5 A

The nominal output peak current limit of 0.5A protects the connected components from excessive current flow, ensuring their safe operation and longevity.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter-based peripheral driver enhances signal processing capabilities and compatibility with various input/output devices, making it a versatile choice for diverse applications.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to effectively control and regulate the current passing through connected devices, ensuring stable operation and protecting the components from overloading.

Technical Specifications

Peripheral Drivers TDE1737DP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDE1737DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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