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TDA7403DTR

STMicroelectronics

TDA7403DTR by STMicroelectronics

TDA7403DTR by STMicroelectronics is a versatile consumer IC designed for audio applications. It operates within a supply voltage range of 7.5-10 V, with a max current of 35 mA and can withstand temperatures from -40 °C to 80°C. Its compact SO package makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,967 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,967

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-

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Vyrian

USA . 1,923 parts In-Stock

1+ parts

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1k+ parts

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1,923

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Anansix

USA . 838 parts In-Stock

1+ parts

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838

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$0.706

100+ parts

-

1k+ parts

$0.635

10k+ parts

-

883

$0.706

-

$0.635

-

MKK Technologies

India . 1,802 parts In-Stock

1+ parts

$1.327

100+ parts

-

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10k+ parts

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1,802

$1.327

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DigiPath Technology Company

USA . 1,802 parts In-Stock

1+ parts

$1.327

100+ parts

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1,802

$1.327

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Microchip USA

USA . 267 parts In-Stock

1+ parts

$2.692

100+ parts

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267

$2.692

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AZTECH Wire

Italy . 961 parts In-Stock

1+ parts

$8.370

100+ parts

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961

$8.370

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Corphita

USA . 2,764 parts In-Stock

1+ parts

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2,764

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Parana Technologies

USA . 1,514 parts In-Stock

1+ parts

-

100+ parts

$0.844

1k+ parts

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10k+ parts

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1,514

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$0.844

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Overview

Unlock superior audio performance with the TDA7403DTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile consumer IC enhances sound quality across various applications, from automotive to home entertainment. Its robust design ensures reliability even in extreme conditions, offering exceptional value and ease of integration. Elevate your projects with a trusted partner committed to excellence, and experience the advantage of cutting-edge technology that truly resonates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this IC reliable for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for compact PCB designs, making it ideal for modern electronics where space is at a premium.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier integration into various circuit layouts, optimizing space utilization.

General IC Type: CONSUMER CIRCUIT

Designed specifically as a consumer circuit IC, it meets the typical requirements and standards of consumer electronics.

No. of Terminals: 20

With 20 terminals, this IC provides ample connectivity options, enabling more complex functionalities in compact designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances packing density, allowing more components to fit on a circuit board.

Maximum Operating Temperature: 80 °C

A high maximum operating temperature ensures reliability in warmer environments, making this IC suitable for diverse applications.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C allows for usage in harsh conditions, broadening its application range.

Terminal Finish: TIN

The tin finish enhances solderability and provides a good electrical connection, ensuring reliable performance during assembly.

Terminal Position: DUAL

Dual terminal positioning offers design flexibility, allowing for better layout in complex circuit environments.

Maximum Seated Height: 2.65 mm

The low seated height aids in achieving slim profile designs, beneficial for portable consumer devices.

Width: 7.5 mm

A width of 7.5 mm provides a balance between size and performance, fitting well into compact device designs.

Minimum Supply Voltage (Vsup): 7.5 V

With a minimum supply voltage of 7.5 V, it is well-suited for a variety of power supply scenarios, enhancing versatility in design.

Length: 12.8 mm

The length is optimized for space considerations in PCB designs, making it easier to incorporate into different layouts.

Technology: BICMOS

Using BICMOS technology provides the advantages of both Bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals ensure optimal solder joint reliability, which is crucial for maintaining performance in consumer products.

Maximum Supply Current: 35 mA

The maximum supply current of 35 mA allows the IC to perform robustly while maintaining energy efficiency, suitable for battery-operated devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common in many designs, making it compatible with a wide range of components and assemblies.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10 V provides flexibility in design, accommodating various power supply configurations.

Technical Specifications

Other Function Consumer ICs TDA7403DTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7403DTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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