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TDA7476013TR

STMicroelectronics

TDA7476013TR by STMicroelectronics

TDA7476013TR by STMicroelectronics is a 24-terminal BCDMOS IC in a small outline package. It features a rectangular shape, gull wing terminals with 1.27mm pitch, and 2.65mm seated height. Ideal for consumer circuit applications requiring surface mount technology in compact designs.

Median Price

$5.152

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 222 parts In-Stock

1+ parts

$5.152

100+ parts

$2.404

1k+ parts

$2.112

10k+ parts

-

222

$5.152

$2.404

$2.112

-

Vyrian

USA . 7,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,416

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 4,960 parts In-Stock

1+ parts

-

100+ parts

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4,960

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-

-

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Zilex Electronics Inc.

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

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4,000

-

-

-

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Digiode

USA . 1,547 parts In-Stock

1+ parts

-

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-

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1,547

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-

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Anansix

USA . 1,508 parts In-Stock

1+ parts

-

100+ parts

-

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1,508

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-

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ACDS - Activité Composants Distribution Service

France . 222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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222

-

-

-

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Dan-Mar Components

USA . 222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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222

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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50

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 491 parts In-Stock

1+ parts

$0.384

100+ parts

-

1k+ parts

$0.345

10k+ parts

-

491

$0.384

-

$0.345

-

MKK Technologies

India . 319 parts In-Stock

1+ parts

$0.721

100+ parts

-

1k+ parts

-

10k+ parts

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319

$0.721

-

-

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DigiPath Technology Company

USA . 319 parts In-Stock

1+ parts

$0.721

100+ parts

-

1k+ parts

-

10k+ parts

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319

$0.721

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-

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Microchip USA

USA . 111 parts In-Stock

1+ parts

$5.765

100+ parts

-

1k+ parts

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111

$5.765

-

-

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Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

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630

$12.800

-

-

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AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$14.895

100+ parts

-

1k+ parts

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419

$14.895

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Lixinc

USA . 19,176 parts In-Stock

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19,176

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A-Z Elektronik GmbH

Germany . 5,495 parts In-Stock

1+ parts

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5,495

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Kepictronics

USA . 4,845 parts In-Stock

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4,845

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Continental Prestige Electronics

USA . 4,276 parts In-Stock

1+ parts

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4,276

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

$0.459

1k+ parts

-

10k+ parts

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1,385

-

$0.459

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Argo Parts USA

USA . 1,298 parts In-Stock

1+ parts

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1,298

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Corphita

USA . 989 parts In-Stock

1+ parts

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989

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RC Electronics

USA . 698 parts In-Stock

1+ parts

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698

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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100

-

-

-

-

Overview

Upgrade your consumer electronics with the TDA7476013TR from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable and innovative solutions for various applications. This consumer circuit IC offers exceptional value, providing enhanced performance and functionality for your devices. With a small outline package design and surface mount capability, this versatile component is perfect for a wide range of electronic projects. Trust STMicroelectronics to bring you cutting-edge technology that exceeds expectations. Experience the difference with the TDA7476013TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and heat resistance, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and cost.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that is easy to integrate into various electronic devices and systems.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics, this IC offers functionality and performance tailored for everyday use in a wide range of devices.

No. of Terminals: 24

With 24 terminals, this IC can accommodate multiple connections and interactions, enabling complex circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, making it suitable for compact electronic devices and applications.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations, offering flexibility in circuit board layout and design.

Maximum Seated Height: 2.65 mm

Low seated height ensures compatibility with slim and compact electronic devices, enhancing overall design flexibility.

Width: 7.5 mm

Compact width enables space-efficient placement on circuit boards, ideal for applications with size constraints.

Length: 15.4 mm

Moderate length offers a balance between compactness and functionality, suitable for a wide range of electronic devices.

Technology: BCDMOS

BCDMOS technology provides efficient power management, low noise, and high-speed performance, enhancing the overall reliability and performance of the IC.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and reliable soldering onto circuit boards, ensuring secure connections and consistent performance.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this IC can be easily integrated into various electronic assemblies and layouts, ensuring compatibility and ease of use.

Technical Specifications

Other Function Consumer ICs TDA7476013TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7476013TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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