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TDA7278

STMicroelectronics

TDA7278 by STMicroelectronics

TDA7278 by STMicroelectronics is a consumer IC with 44 terminals in a square package. It operates b/w -25 °C to 70°C, with power supplies ranging from 1.6V to 7V. This CMOS technology IC is ideal for various consumer circuit applications due to its compact flatpack design and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,126

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-

-

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Digiode

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,233

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-

-

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Anansix

USA . 1,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,932

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,187 parts In-Stock

1+ parts

$2.283

100+ parts

-

1k+ parts

$2.055

10k+ parts

-

1,187

$2.283

-

$2.055

-

MKK Technologies

India . 106 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

-

10k+ parts

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106

$4.294

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DigiPath Technology Company

USA . 106 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

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10k+ parts

-

106

$4.294

-

-

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Corphita

USA . 2,914 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,914

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-

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Parana Technologies

USA . 1,123 parts In-Stock

1+ parts

-

100+ parts

$2.730

1k+ parts

-

10k+ parts

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1,123

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$2.730

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Overview

Looking to enhance your consumer electronic devices with top-notch performance and reliability? Look no further than the TDA7278 by STMicroelectronics. With a reputation for superior quality and cutting-edge technology, STMicroelectronics delivers products that exceed industry standards. The TDA7278, part of the other function consumer ICs category, offers a wide range of applications and benefits for customers. From its compact package body material to its nickel palladium gold terminal finish, this high-performing IC provides value and efficiency for all your electronic needs. Upgrade your devices with the TDA7278 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the integrated circuit, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy installation onto printed circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape is efficient for space utilization on PCBs, maximizing component density in a compact design.

Power Supplies (V): 1.6/7

Support for a wide range of power supplies (1.6V to 7V) allows for compatibility with different voltage systems, enhancing versatility.

No. of Terminals: 44

With 44 terminals, this IC offers multiple connection points for various input and output signals, enabling complex circuit configurations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70 °C ensures stable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature of -25 °C allows for reliable operation in cold conditions, expanding the range of possible applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, promoting long-term reliability.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and soldering processes, ensuring efficient installation and maintenance.

Maximum Seated Height: 2.45 mm

Low maximum seated height of 2.45mm allows for a compact overall profile, ideal for space-constrained applications.

Width: 10 mm

Narrow width of 10mm facilitates placement in tight spaces on PCBs, enabling efficient board layout and space optimization.

Minimum Supply Voltage (Vsup): 1.6 V

Support for low minimum supply voltage of 1.6V enables operation in low-power scenarios, conserving energy and extending battery life.

Length: 10 mm

Short length of 10mm contributes to the compact footprint of the IC, suitable for applications where space is a premium.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability during soldering and enhances heat dissipation, ensuring a secure electrical connection.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density packing of terminals on the IC, maximizing connectivity options in a limited space.

Maximum Supply Voltage (Vsup): 5 V

High maximum supply voltage of 5V supports compatibility with standard voltage levels, making the IC suitable for a wide range of applications.

Technical Specifications

Other Function Consumer ICs TDA7278 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.6/7

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7278 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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