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TDA7333

STMicroelectronics

TDA7333 by STMicroelectronics

TDA7333 by STMicroelectronics is a compact consumer IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a 16-terminal gull-wing package with a supply voltage range of 3V to 3.6V. Ideal for surface mount designs, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,828

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-

-

-

Anansix

USA . 2,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,101

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-

-

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Vyrian

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

580

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 623 parts In-Stock

1+ parts

$1.915

100+ parts

-

1k+ parts

$1.723

10k+ parts

-

623

$1.915

-

$1.723

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MKK Technologies

India . 1,851 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1,851

$3.600

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-

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DigiPath Technology Company

USA . 1,851 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1,851

$3.600

-

-

-

A-Z Elektronik GmbH

Germany . 5,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,163

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-

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Corphita

USA . 2,673 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,673

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-

-

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Parana Technologies

USA . 2,171 parts In-Stock

1+ parts

-

100+ parts

$2.289

1k+ parts

-

10k+ parts

-

2,171

-

$2.289

-

-

Overview

Elevate your audio experience with the TDA7333 from STMicroelectronics—a pinnacle of quality and reliability in consumer ICs. Designed for seamless integration into various applications, this compact device delivers outstanding performance while ensuring energy efficiency. With STMicroelectronics' legacy of innovation and excellence, the TDA7333 empowers creators to produce superior sound solutions that captivate users and enhance everyday enjoyment. Discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protects the internal components from environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for a reduced footprint and easier integration into compact electronics designs, making it suitable for modern applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and provides a standardized form factor for easy handling and placement.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring that the IC meets the performance demands of a wide range of applications.

Power Supplies (V): 3.3

Operating at 3.3V provides compatibility with various digital systems and reduces power consumption, making it energy-efficient.

No. of Terminals: 16

Having 16 terminals allows for flexibility in circuit design and supports a variety of input/output configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for high-density applications, maximizing space on PCBs.

Maximum Operating Temperature: 85 °C

With a max temperature of 85 °C, the IC is suitable for industrial applications that may experience higher thermal environments.

Minimum Operating Temperature: -40 °C

The capacity to operate down to -40 °C ensures reliability in extreme cold environments, making it ideal for outdoor or harsh environment use.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and enhances reliability during the manufacturing process.

Terminal Position: DUAL

Dual terminal positioning allows for more versatile layout options on the PCB, facilitating easier integration.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm ensures compatibility with thin-profile designs, saving valuable space.

Width: 4.4 mm

The compact width makes it suitable for space-constrained designs, such as mobile devices and wearables.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V provides operational flexibility and compatibility with a range of power supply designs.

Length: 5 mm

A length of 5 mm contributes to the compact form factor necessary for modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial grade specifications ensure robustness and reliability, making this IC suitable for demanding applications.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, enhancing the performance of consumer electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and facilitate easy reflow soldering processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports denser designs while maintaining a balance between performance and manufacturability.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V provides flexibility and ensures compatibility with various power requirements.

Technical Specifications

Other Function Consumer ICs TDA7333 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDA7333 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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