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TDA7331D

STMicroelectronics

TDA7331D by STMicroelectronics

TDA7331D by STMicroelectronics is a 20-terminal IC with 5V power supply, operating b/w -40 to 85 °C. It is a consumer circuit in small outline package for industrial use, featuring CMOS technology and dual terminal position. Suitable for surface mount applications with nickel palladium gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,531 parts In-Stock

1+ parts

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1k+ parts

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5,531

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Digiode

USA . 1,924 parts In-Stock

1+ parts

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1,924

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Anansix

USA . 641 parts In-Stock

1+ parts

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 268 parts In-Stock

1+ parts

$0.161

100+ parts

-

1k+ parts

$0.145

10k+ parts

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268

$0.161

-

$0.145

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MKK Technologies

India . 263 parts In-Stock

1+ parts

$0.303

100+ parts

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263

$0.303

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DigiPath Technology Company

USA . 263 parts In-Stock

1+ parts

$0.303

100+ parts

-

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263

$0.303

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AZTECH Wire

Italy . 979 parts In-Stock

1+ parts

$13.020

100+ parts

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979

$13.020

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Corphita

USA . 4,087 parts In-Stock

1+ parts

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4,087

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Parana Technologies

USA . 392 parts In-Stock

1+ parts

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100+ parts

$0.192

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392

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$0.192

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Overview

Discover the cutting-edge TDA7331D by STMicroelectronics, a top-tier manufacturer known for its superior quality and innovative technology in the consumer ICs category. This compact and versatile product offers customers unparalleled value with its high performance and reliability. Ideal for a wide range of applications, this small outline package is designed for industrial-grade temperatures and features dual terminals for easy installation. Trust STMicroelectronics to deliver outstanding products that meet your needs and exceed your expectations. Elevate your projects with the TDA7331D today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Compact shape that fits well in most electronic devices, optimizing space usage.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics, ensuring compatibility and performance.

Power Supplies (V): 5

Standard voltage supply for consumer electronics, ensuring compatibility with most systems.

No. of Terminals: 20

Provides multiple connections for various functions, increasing versatility and options for use.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space on circuit boards, allowing for more components in a limited area.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without risk of damage, increasing reliability.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without loss of performance, ensuring functionality in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish that resists corrosion and provides stable connections for long-term use.

Terminal Position: DUAL

Dual terminal positioning allows for efficient connections and reduces the risk of signal interference.

Maximum Seated Height: 2.65 mm

Low profile design that fits well in compact devices, maximizing space efficiency.

Width: 7.5 mm

Narrow width that saves space on circuit boards, allowing for more components to be added.

Minimum Supply Voltage (Vsup): 4.5 V

Ability to operate at lower voltages, saving power and reducing energy consumption.

Length: 12.8 mm

Compact length that fits well in most electronic devices, optimizing space usage.

Temperature Grade: INDUSTRIAL

Industrial-grade components that can withstand challenging environments and conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, ideal for consumer electronics.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and easy installation on circuit boards.

Maximum Supply Current: 9 mA

Low current consumption that saves power and reduces energy costs.

Terminal Pitch: 1.27 mm

Close terminal pitch for efficient connections and reduced signal interference.

Maximum Supply Voltage (Vsup): 5.5 V

Safe operating voltage that prevents damage to the device and ensures stable performance.

Technical Specifications

Other Function Consumer ICs TDA7331D attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7331D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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