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TDA7270S

STMicroelectronics

TDA7270S by STMicroelectronics

TDA7270S by STMicroelectronics is a 16-terminal IC with 14V power supply, 15mA max current. It uses bipolar technology in rectangular plastic/epoxy package for consumer applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,089 parts In-Stock

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4,089

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Vyrian

USA . 2,028 parts In-Stock

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2,028

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Anansix

USA . 1,032 parts In-Stock

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1,032

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Huijzer Components

Netherlands . 56 parts In-Stock

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56

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GES GmbH

Germany . 26 parts In-Stock

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26

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Corel Iberica Componentes, S.L.

Spain . 25 parts In-Stock

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25

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Fibra_Brandt Electronic GMBH

Germany . 19 parts In-Stock

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ECAB

Sweden . 15 parts In-Stock

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15

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LittleDiode

UK . 4 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,486 parts In-Stock

1+ parts

$1.462

100+ parts

-

1k+ parts

$1.316

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1,486

$1.462

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$1.316

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MKK Technologies

India . 721 parts In-Stock

1+ parts

$2.749

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721

$2.749

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DigiPath Technology Company

USA . 721 parts In-Stock

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$2.749

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721

$2.749

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Corphita

USA . 3,125 parts In-Stock

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Parana Technologies

USA . 672 parts In-Stock

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$1.748

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672

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$1.748

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Assy Fe

Spain . 33 parts In-Stock

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Overview

Elevate your consumer electronics with the TDA7270S from STMicroelectronics, a trusted manufacturer known for its top-notch quality and reliability. This versatile IC offers endless possibilities in various applications, ensuring superior performance and efficiency. With its innovative technology and durable construction, this product is designed to meet and exceed your expectations. Upgrade your projects with the TDA7270S and experience the value, benefits, and advantages it brings to your creations. Elevate your designs with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and reliable, making this product suitable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit boards.

Power Supplies (V): 14

Operating at 14V provides a good balance between power efficiency and performance.

No. of Terminals: 16

Having 16 terminals offers flexibility in connecting this product to other components and circuits.

Package Style (Meter): IN-LINE

In-line package style allows for space-saving and organized layout in electronic designs.

Terminal Position: DUAL

Dual terminal position enables better stability and connectivity for this product.

Technology: BIPOLAR

Bipolar technology ensures reliable and consistent performance of this product.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering during assembly.

Maximum Supply Current: 15 mA

Low maximum supply current of 15 mA ensures energy efficiency of this product.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm simplifies PCB layout and assembly processes.

Technical Specifications

Other Function Consumer ICs TDA7270S attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

15 mA

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA7270S General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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