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TDA7330BD

STMicroelectronics

TDA7330BD by STMicroelectronics

TDA7330BD by STMicroelectronics is a BICMOS IC with 20 terminals, operating at 4.5-5.5V, suitable for consumer circuits in industrial settings. It has a small outline package measuring 12.8mm x 7.5mm x 2.65mm, with a temperature range of -40 to 85 °C and surface-mount capability for easy integration.

Median Price

$7.840

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

$7.840

100+ parts

$3.397

1k+ parts

$3.214

10k+ parts

-

3,000

$7.840

$3.397

$3.214

-

Digiode

USA . 4,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,833

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-

-

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Cyclops Electronics Ltd

UK . 4,623 parts In-Stock

1+ parts

-

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4,623

-

-

-

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Microfarads

USA . 2,892 parts In-Stock

1+ parts

-

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2,892

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-

-

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Vyrian

USA . 2,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,574

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-

-

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Extreme Components

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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-

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Anansix

USA . 662 parts In-Stock

1+ parts

-

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662

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

1+ parts

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

$0.099

10k+ parts

-

1,729

$0.110

-

$0.099

-

MKK Technologies

India . 830 parts In-Stock

1+ parts

$0.208

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$0.208

-

-

-

DigiPath Technology Company

USA . 830 parts In-Stock

1+ parts

$0.208

100+ parts

-

1k+ parts

-

10k+ parts

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830

$0.208

-

-

-

A-Z Elektronik GmbH

Germany . 4,979 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,979

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-

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Corphita

USA . 2,784 parts In-Stock

1+ parts

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2,784

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-

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Parana Technologies

USA . 2,121 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

-

10k+ parts

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2,121

-

$0.132

-

-

Assy Fe

Spain . 2,006 parts In-Stock

1+ parts

-

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2,006

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Perfect Parts

USA . 43 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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43

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Overview

Unleash the power of innovation with the TDA7330BD by STMicroelectronics, a cutting-edge consumer circuit designed for high-quality performance. With a focus on superior manufacturing standards and advanced technology, STMicroelectronics delivers top-of-the-line solutions for a wide range of applications. Experience the value and benefits of this small outline package, offering reliability and efficiency in a compact design. Elevate your projects with the TDA7330BD and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Power Supplies (V): 5

Operates on a standard voltage, making it compatible with most power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Technology: BiCMOS

Combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Other Function Consumer ICs TDA7330BD attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7330BD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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