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T810-700K

STMicroelectronics

T810-700K by STMicroelectronics

STMicroelectronics T810-700K is a 4-quadrant logic level TRIAC with 700V repetitive peak off-state voltage and 8A max RMS on-state current. It operates b/w -40 °C to 125°C, suitable for AC power control applications. This single configuration device comes in a surface-mount package with Gull Wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,229 parts In-Stock

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4,229

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Vyrian

USA . 2,635 parts In-Stock

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2,635

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Anansix

USA . 503 parts In-Stock

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503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$2.036

100+ parts

-

1k+ parts

$1.832

10k+ parts

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60

$2.036

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$1.832

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MKK Technologies

India . 1,688 parts In-Stock

1+ parts

$3.828

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1,688

$3.828

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DigiPath Technology Company

USA . 1,688 parts In-Stock

1+ parts

$3.828

100+ parts

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1,688

$3.828

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Corphita

USA . 3,049 parts In-Stock

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3,049

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Parana Technologies

USA . 443 parts In-Stock

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$2.434

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443

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$2.434

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Overview

Looking for a reliable and high-quality TRIAC for your alternating current applications? Look no further than the T810-700K by STMicroelectronics. With its durable plastic/epoxy package body material and 700V repetitive peak off-state voltage, this single configuration TRIAC is perfect for various AC control applications. Offering a maximum RMS on-state current of 8A and a 4 quadrant logic level trigger device type, the T810-700K provides excellent performance and reliability. Trust STMicroelectronics to deliver top-notch products that meet your needs and exceed your expectations. Upgrade to the T810-700K today for superior results in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

With a high maximum DC gate trigger current, this product can be easily controlled with low power consumption.

Configuration: SINGLE

Single configuration makes the product easy to install and operate, ideal for simpler applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into compact circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board.

No. of Terminals: 3

With 3 terminals, this product allows for easy connectivity and control in a circuit.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and ease of mounting in various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4-quadrant logic level TRIAC design enables precise and efficient control of AC power.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can operate effectively in cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and reduces the chances of error.

Maximum RMS On-state Current: 8 A

The high maximum RMS on-state current allows for the handling of higher loads with ease.

Repetitive Peak Off-state Voltage: 700 V

With a high repetitive peak off-state voltage, this product can withstand voltage fluctuations and surges.

Technical Specifications

Triode For Alternating Current (TRIAC) T810-700K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JESD-30 Code:

R-PSFM-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T810-700K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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