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T810-600G

STMicroelectronics

T810-600G by STMicroelectronics

T810-600G by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 8 A and a repetitive peak off-state voltage of 600 V. It operates b/w -40 °C to 125 °C with a gate trigger current of just 10 mA. Ideal for compact surface mount designs, it ensures efficient control in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,128 parts In-Stock

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5,128

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Digiode

USA . 4,659 parts In-Stock

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4,659

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Anansix

USA . 2,494 parts In-Stock

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2,494

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LWI Electronics Inc

India . 4 parts In-Stock

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4

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IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$2.729

100+ parts

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$2.456

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1,753

$2.729

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$2.456

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MKK Technologies

India . 2,073 parts In-Stock

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$5.131

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2,073

$5.131

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DigiPath Technology Company

USA . 2,073 parts In-Stock

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$5.131

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2,073

$5.131

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AZTECH Wire

Italy . 578 parts In-Stock

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$9.070

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578

$9.070

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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538

$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 756 parts In-Stock

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756

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Parana Technologies

USA . 594 parts In-Stock

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$3.263

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594

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$3.263

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Overview

Unlock the power of precision and reliability with the T810-600G from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance TRIAC is designed for seamless control in various applications, ensuring efficiency and durability under tough conditions. With its compact design and robust capabilities, you can confidently integrate it into your projects, reaping the benefits of enhanced safety and optimized performance. Elevate your designs with STMicroelectronics—where quality meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects against environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

A low gate trigger current makes this TRIAC energy-efficient and compatible with low-power control circuits.

Configuration: SINGLE

Single configuration simplifies design and implementation in electronic circuits.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, enabling better space utilization in applications.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient heat dissipation and space-efficient layouts.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improved mechanical stability in mounted applications.

Maximum Leakage Current: 1 mA

Low leakage current ensures minimal power loss and enhances device reliability, especially in standby applications.

No. of Terminals: 2

The simplicity of a two-terminal design allows for straightforward integration into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in reducing PCB space requirements and fits well in compact designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding environments, making it versatile for different uses.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant capability allows the TRIAC to control AC loads effectively across a wide range of conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for both cold and hot environments.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances solderability and resistance to oxidation.

Terminal Position: SINGLE

Single terminal position simplifies layout and assembly in circuit designs.

Maximum RMS On-state Current: 8 A

An 8 A on-state current rating indicates robust performance in controlling significant loads.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage enhances compatibility with low-voltage control circuits.

Case Connection: MAIN TERMINAL 2

Main terminal connection enhances the performance and reliability in switching applications.

Repetitive Peak Off-state Voltage: 600 V

A high off-state voltage rating allows the TRIAC to be used in high-voltage applications safely.

Minimum Critical Rate of Rise of Off-state Voltage: 40 V/us

A minimum critical rate of rise ensures safe operation during voltage spikes, enhancing device reliability.

Maximum Holding Current: 15 mA

The low holding current makes this TRIAC suitable for applications requiring low power consumption.

Technical Specifications

Triode For Alternating Current (TRIAC) T810-600G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

40 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

1 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T810-600G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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