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T810-600K

STMicroelectronics

T810-600K by STMicroelectronics

STMicroelectronics T810-600K is a 4-quadrant logic level TRIAC with 600V repetitive peak off-state voltage and 8A max RMS on-state current. It operates b/w -40 °C to 125°C, suitable for AC power control applications. This single configuration device comes in a surface-mount package with Gull Wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,311 parts In-Stock

1+ parts

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2,311

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Digiode

USA . 1,671 parts In-Stock

1+ parts

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1,671

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Anansix

USA . 1,112 parts In-Stock

1+ parts

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1,112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 183 parts In-Stock

1+ parts

$4.592

100+ parts

-

1k+ parts

$4.133

10k+ parts

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183

$4.592

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$4.133

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MKK Technologies

India . 921 parts In-Stock

1+ parts

$8.634

100+ parts

-

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921

$8.634

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DigiPath Technology Company

USA . 921 parts In-Stock

1+ parts

$8.634

100+ parts

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921

$8.634

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Corphita

USA . 3,875 parts In-Stock

1+ parts

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3,875

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Parana Technologies

USA . 2,119 parts In-Stock

1+ parts

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100+ parts

$5.490

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2,119

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$5.490

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Overview

Elevate your electronic projects with the T810-600K by STMicroelectronics, a top-of-the-line TRIAC that boasts quality and reliability. Manufactured by a trusted name in the industry, this single configuration device is perfect for a variety of applications. From lighting controls to motor speed regulation, this TRIAC offers seamless performance and efficiency. Say goodbye to technical woes and hello to smooth operations with the T810-600K. Experience the value and benefits of this product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and durability for the internal components of the TRIAC, making it reliable for long-term use.

Maximum DC Gate Trigger Current: 10 mA

Allows for efficient and precise control of the TRIAC, ensuring smooth operation and accurate switching.

Configuration: SINGLE

Simplified design with a single configuration makes installation and integration easier.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and allowing for high-density circuit designs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment within electronic circuits.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and solder connections for reliable performance.

No. of Terminals: 3

Optimal number of terminals for connecting to external circuitry, simplifying installation and reducing complexity.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure and stable attachment to the application, preventing damage or disconnection.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in a wide range of environments and applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Advanced trigger device type enables precise control and efficient operation of the TRIAC in various load conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions, suitable for diverse applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and corrosion resistance for secure and long-lasting electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies wiring and installation, reducing the chances of errors or complications.

Maximum RMS On-state Current: 8 A

High maximum RMS on-state current capacity allows for handling a wide range of loads and ensures reliable switching performance.

Repetitive Peak Off-state Voltage: 600 V

High repetitive peak off-state voltage rating ensures safe operation and protection against voltage spikes or transients.

Technical Specifications

Triode For Alternating Current (TRIAC) T810-600K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JESD-30 Code:

R-PSFM-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T810-600K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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