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T1620-800W

STMicroelectronics

T1620-800W by STMicroelectronics

T1620-800W by STMicroelectronics is a snubberless TRIAC designed for AC control applications. It features a max RMS on-state current of 16 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125 °C. Ideal for efficient power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,040 parts In-Stock

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1,040

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Anansix

USA . 945 parts In-Stock

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945

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Digiode

USA . 63 parts In-Stock

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63

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 315 parts In-Stock

1+ parts

$2.961

100+ parts

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1k+ parts

$2.665

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315

$2.961

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$2.665

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MKK Technologies

India . 530 parts In-Stock

1+ parts

$5.567

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530

$5.567

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

$5.567

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530

$5.567

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Corphita

USA . 3,853 parts In-Stock

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3,853

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Parana Technologies

USA . 1,985 parts In-Stock

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$3.540

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1,985

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$3.540

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Overview

Elevate your projects with the T1620-800W from STMicroelectronics, a leader in semiconductor innovation. This robust TRIAC ensures reliable performance across diverse applications, delivering superior quality and efficiency. Its snubberless design minimizes electromagnetic interference, making it ideal for residential and industrial control systems. Trust in STMicroelectronics’ legacy of excellence to enhance your designs with unparalleled durability and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the TRIAC reliable for various applications.

Maximum DC Gate Trigger Current: 20 mA

A maximum gate trigger current of 20 mA allows for efficient operation with lower power consumption in control circuits.

Configuration: SINGLE

The single configuration simplifies integration into circuits, making it a convenient choice for designers.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, ideal for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure mounting and stable electrical connections, ideal for robust applications.

Maximum Leakage Current: 0.005 mA

A low leakage current minimizes energy loss and enhances reliability, crucial for energy-efficient designs.

Number of Terminals: 3

The three-terminal design simplifies the control of AC loads, making it versatile for various circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for easy installation and added structural support, enhancing durability in operation.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C provides a wide thermal range, ensuring reliable performance in high-temperature environments.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces noise and improves efficiency, making it suitable for sensitive electronic applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows the TRIAC to function effectively in extreme cold conditions, enhancing versatility.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and corrosion resistance, promoting the longevity of connections.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, streamlining assembly and installation.

Maximum RMS On-state Current: 16 A

With a maximum RMS on-state current of 16 A, this TRIAC can handle substantial loads, making it suitable for various high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage of 1.3 V facilitates easy interfacing with most control signals, simplifying circuit design.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unwanted interactions with other circuit components.

Repetitive Peak Off-state Voltage: 800 V

A high repetitive peak off-state voltage of 800 V allows for usage in high-voltage applications, ensuring robustness.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/us

A high critical rate of rise ensures better control over voltage changes, protecting the circuit from overvoltage conditions.

Maximum Holding Current: 35 mA

The maximum holding current of 35 mA makes the TRIAC efficient in maintaining operation without unnecessary power consumption.

Technical Specifications

Triode For Alternating Current (TRIAC) T1620-800W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

20 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1620-800W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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