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T1613SH

STMicroelectronics

T1613SH by STMicroelectronics

T1613SH by STMicroelectronics is a TRIAC designed for AC applications, featuring a max RMS on-state current of 16 A and a repetitive peak off-state voltage of 700 V. It operates b/w -40 °C to 125 °C with a gate trigger current of 50 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,165 parts In-Stock

1+ parts

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2,165

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Digiode

USA . 1,857 parts In-Stock

1+ parts

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1k+ parts

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1,857

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Vyrian

USA . 1,479 parts In-Stock

1+ parts

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10k+ parts

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1,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$2.490

100+ parts

-

1k+ parts

$2.241

10k+ parts

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217

$2.490

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$2.241

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MKK Technologies

India . 815 parts In-Stock

1+ parts

$4.681

100+ parts

-

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815

$4.681

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DigiPath Technology Company

USA . 815 parts In-Stock

1+ parts

$4.681

100+ parts

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1k+ parts

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10k+ parts

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815

$4.681

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Corphita

USA . 4,380 parts In-Stock

1+ parts

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4,380

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Parana Technologies

USA . 1,849 parts In-Stock

1+ parts

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100+ parts

$2.977

1k+ parts

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1,849

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$2.977

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Overview

Unlock unparalleled performance with the T1613SH TRIAC from STMicroelectronics, a leader in innovative semiconductor solutions. Perfect for controlling alternating currents, this reliable component thrives in demanding environments, operating efficiently between -40 °C to 125 °C. With robust design and minimal leakage, it ensures longevity and energy savings in applications like lighting control and motor management, making it an invaluable asset for your projects. Experience quality and peace of mind with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides excellent insulation and durability, making the TRIAC suitable for various environmental conditions.

Maximum DC Gate Trigger Current: 50 mA

A maximum gate trigger current of 50 mA allows for efficient control of the TRIAC, ensuring that minimal power is required to activate it.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it a versatile choice for a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage and allows for easy mounting in various circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and are ideal for prototyping and assembly, ensuring robust connections.

Maximum Leakage Current: 2.5 mA

A low maximum leakage current ensures energy efficiency and reduces the risk of overheating, enhancing overall reliability.

No. of Terminals: 3

The three-terminal design facilitates straightforward circuit connectivity and versatility in application configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances stability during operation and simplifies installation in various systems, providing robust mechanical support.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this TRIAC is suitable for high-temperature environments, adding to its durability.

Trigger Device Type: TRIAC

As a TRIAC, this device is perfect for controlling AC power, making it essential for applications like dimmers and motor speed controls.

Minimum Operating Temperature: -40 °C

Its capability to operate down to -40 °C ensures reliable performance in harsh conditions and extreme environments.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides excellent solderability and resistance to corrosion, enhancing the device's longevity and reliability.

Terminal Position: SINGLE

The single terminal position simplifies design layout and offers flexibility in circuit placement.

Maximum RMS On-state Current: 16 A

The ability to handle up to 16 A of RMS on-state current makes this TRIAC ideal for controlling high-power loads.

Maximum DC Gate Trigger Voltage: 2.5 V

A low gate trigger voltage requirement means reduced control circuit complexity and lower power consumption for activation.

Repetitive Peak Off-state Voltage: 700 V

With a high off-state voltage rating, this TRIAC can effectively handle significant voltage spikes, enhancing system protection.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/µs

A high critical rate of rise of off-state voltage ensures reliable performance under rapid voltage changes, ideal for fast-switching applications.

Maximum Holding Current: 150 mA

A maximum holding current of 150 mA ensures stable operation while allowing for low current conditions, refining control capabilities.

Technical Specifications

Triode For Alternating Current (TRIAC) T1613SH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

150 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1613SH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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