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T1612MH

STMicroelectronics

T1612MH by STMicroelectronics

T1612MH by STMicroelectronics is a TRIAC with 16A RMS on-state current, 600V repetitive peak off-state voltage, and 50mA max DC gate trigger current. It is ideal for applications requiring precise AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,382

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-

-

-

Vyrian

USA . 3,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,184

-

-

-

-

Anansix

USA . 1,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

-

-

-

-

Fibra_Brandt Electronic GMBH

Germany . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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29

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-

-

LittleDiode

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,200 parts In-Stock

1+ parts

$4.553

100+ parts

-

1k+ parts

$4.098

10k+ parts

-

1,200

$4.553

-

$4.098

-

MKK Technologies

India . 1,072 parts In-Stock

1+ parts

$8.562

100+ parts

-

1k+ parts

-

10k+ parts

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1,072

$8.562

-

-

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DigiPath Technology Company

USA . 1,072 parts In-Stock

1+ parts

$8.562

100+ parts

-

1k+ parts

-

10k+ parts

-

1,072

$8.562

-

-

-

Parana Technologies

USA . 1,957 parts In-Stock

1+ parts

-

100+ parts

$5.444

1k+ parts

-

10k+ parts

-

1,957

-

$5.444

-

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Corphita

USA . 841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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841

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Overview

Enhance your electronic projects with the T1612MH by STMicroelectronics, a reliable and high-quality TRIAC that offers excellent performance and durability. Manufactured by STMicroelectronics, a trusted industry leader known for their innovative technology and superior products, this TRIAC is perfect for a wide range of applications. From home automation to industrial control systems, the T1612MH provides exceptional value, efficiency, and precision. Experience the benefits of this product firsthand and take your projects to the next level with the T1612MH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection, making this product suitable for a variety of applications.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum DC gate trigger current, this product offers reliable performance and efficient switching.

Configuration: SINGLE

The single configuration simplifies installation and makes the product easy to use in various circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB mounting and space-saving design.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and ease of soldering during assembly.

Maximum Leakage Current: 2.5 mA

Low maximum leakage current helps improve the energy efficiency and reliability of the product.

No. of Terminals: 3

With three terminals, this product offers flexibility in circuit design and connections.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and easy mounting options in various applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in demanding environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level triac trigger device type allows for precise control and efficient switching in both directions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can withstand extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and ensures a secure connection for long-term use.

Terminal Position: SINGLE

Single terminal position simplifies installation and ensures compatibility with various circuit layouts.

Maximum RMS On-state Current: 16 A

High maximum RMS on-state current allows for handling heavy loads and ensures reliable performance in high-power applications.

Maximum DC Gate Trigger Voltage: 2.5 V

Low maximum DC gate trigger voltage enables efficient triggering and precise control of the product.

Repetitive Peak Off-state Voltage: 600 V

High repetitive peak off-state voltage ensures the product can handle high-voltage applications safely and reliably.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

High minimum critical rate of rise of off-state voltage allows for fast and efficient switching to protect circuits from overvoltage.

Maximum Holding Current: 100 mA

High maximum holding current ensures the product can maintain the on-state even under varying conditions for reliable operation.

Technical Specifications

Triode For Alternating Current (TRIAC) T1612MH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

100 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1612MH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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