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STW43NM50N

STMicroelectronics

STW43NM50N by STMicroelectronics

STW43NM50N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 500V breakdown voltage, 37A max drain current, and 255W power dissipation. Ideal for high-efficiency circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,411 parts In-Stock

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8,411

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Anansix

USA . 2,662 parts In-Stock

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2,662

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Digiode

USA . 2,593 parts In-Stock

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2,593

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 307 parts In-Stock

1+ parts

$1.698

100+ parts

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$1.528

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307

$1.698

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$1.528

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MKK Technologies

India . 1,222 parts In-Stock

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$3.194

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$3.194

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DigiPath Technology Company

USA . 1,222 parts In-Stock

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$3.194

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1,222

$3.194

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AZTECH Wire

Italy . 175 parts In-Stock

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$17.200

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175

$17.200

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A-Z Elektronik GmbH

Germany . 6,912 parts In-Stock

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6,912

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Corphita

USA . 4,825 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,470 parts In-Stock

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3,470

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Parana Technologies

USA . 1,815 parts In-Stock

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$2.031

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1,815

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$2.031

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Perfect Parts

USA . 183 parts In-Stock

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Overview

Unlock unparalleled efficiency in your designs with the STW43NM50N from STMicroelectronics, a leader in innovation and reliability. This N-channel power FET excels in switching applications, delivering robust performance with exceptional thermal capabilities. Built on advanced MOSFET technology, it ensures reduced energy loss and enhanced durability, making it ideal for high-power electronics. Choose STMicroelectronics for quality you can trust and experience the transformative benefits of superior power management today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher efficiency and are commonly used in high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds extra versatility, allowing for easier integration into circuits while providing protection against reverse current.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable performance in power management and control systems.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage indicates the ability to operate in demanding environments, making this FET suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, aiding in compact design solutions.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong mechanical connections and is often preferred in situations requiring ruggedness.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to lower power consumption in idle states, enhancing overall circuit efficiency.

Maximum Pulsed Drain Current (IDM): 148 A

With a high pulsed drain current capability, this transistor is ideal for applications that require short bursts of high power.

Maximum Drain Current (Abs) (ID): 37 A

The maximum continuous drain current rating ensures reliable operation in high-load applications without overheating.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and reduces complexity in connections.

Maximum Power Dissipation (Abs): 255 W

High power dissipation capability allows the FET to handle demanding applications without risking thermal failure.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures stable fixation and efficient heat dissipation, which is critical for high-power devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology facilitates low power consumption, high switching speed, and reduced heat generation, making this FET suitable for modern designs.

Maximum Operating Temperature: 150 °C

The high operating temperature threshold makes this FET reliable in extreme environments, ensuring long-term performance.

Transistor Element Material: SILICON

Silicon provides excellent semiconductor properties, contributing to effective performance and reliability in various applications.

Maximum Drain Current (ID): 37 A

This specification reiterates the transistor's strength in handling substantial currents, ideal for high-load applications.

Maximum Drain-Source On Resistance: 0.085 ohm

Low on-resistance minimizes energy loss during operation, enhancing the overall efficiency of power circuits.

Terminal Position: SINGLE

A single terminal position helps simplify circuit design and layout, enabling efficient manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) STW43NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

148 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW43NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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