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STW45NM60D

STMicroelectronics

STW45NM60D by STMicroelectronics

STW45NM60D by STMicroelectronics is a power FET with N-channel configuration and 600V DS breakdown voltage. It is used for switching applications, offering a max pulsed drain current of 180A and an avalanche energy rating of 850mJ.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 922 parts In-Stock

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Digiode

USA . 523 parts In-Stock

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Vyrian

USA . 311 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Corohmni

South Africa . 402 parts In-Stock

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$0.404

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402

$0.404

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Aztec Data Supply Inc.

USA . 249 parts In-Stock

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$1.070

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$1.070

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IDEA Electronic Components Group

UK . 438 parts In-Stock

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$1.526

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$1.374

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$1.526

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MKK Technologies

India . 1,194 parts In-Stock

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$2.870

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$2.870

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DigiPath Technology Company

USA . 1,194 parts In-Stock

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$2.870

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$2.870

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AZTECH Wire

Italy . 245 parts In-Stock

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$8.184

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Semicontronic

India . 1,056 parts In-Stock

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$26.050

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$25.399

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$25.268

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Ampacity Inc.

Singapore . 956 parts In-Stock

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$64.050

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Continental Prestige Electronics

USA . 6,412 parts In-Stock

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Argo Parts USA

USA . 2,965 parts In-Stock

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Corphita

USA . 1,822 parts In-Stock

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Parana Technologies

USA . 1,259 parts In-Stock

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$1.825

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Bastille Electronics

Australia . 700 parts In-Stock

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Overview

Discover the power of innovation with the STW45NM60D by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers unmatched quality and reliability. The STW45NM60D belongs to the Power Field Effect Transistors (FET) category, offering incredible benefits and advantages for various applications. With its N-CHANNEL polarity and SINGLE WITH BUILT-IN DIODE configuration, this transistor is perfect for switching operations. Its impressive 600V minimum DS Breakdown Voltage ensures stability and performance. Experience enhanced functionality, superior efficiency, and exceptional value with the STW45NM60D. Upgrade your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protects the internal components, making this power FET suitable for various environments.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for more efficient power switching, resulting in improved performance and power savings.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces the need for additional components, making it an ideal choice for applications where space and cost are critical.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET provides fast and reliable switching performance, ensuring efficient control and regulation of power flow.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600 V, this power FET can handle high voltage applications, making it suitable for use in power supplies, motor control, and industrial equipment.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various circuit boards and systems, enhancing its versatility and ease of use.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure and reliable connection, allowing for easy installation and maintenance.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode ensures low power consumption and improved efficiency, making this power FET ideal for battery-powered devices and energy-efficient applications.

Maximum Pulsed Drain Current (IDM): 180 A

The high maximum pulsed drain current capability of 180 A allows for the handling of large transient current spikes, providing robust performance and protection against overloads.

Avalanche Energy Rating (EAS): 850 mJ

The high avalanche energy rating of 850 mJ ensures the power FET can withstand and dissipate energy during voltage transients, enhancing its reliability and longevity.

No. of Terminals: 3

With three terminals, this power FET provides simple connections and compatibility with standard interface circuits, enabling easy integration into existing systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers sturdy mechanical support and facilitates heat dissipation, making it suitable for high-power applications where thermal management is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this power FET delivers excellent performance, low power consumption, and high switching speeds.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this power FET can operate reliably in demanding environments, ensuring stable performance even under elevated temperature conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material offers excellent electrical and thermal properties, resulting in enhanced performance, reliability, and temperature robustness.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides corrosion resistance and ensures a reliable electrical connection, making this power FET suitable for long-term use.

Maximum Drain Current (ID): 45 A

With a maximum drain current of 45 A, this power FET can handle high current loads, making it a suitable choice for applications that require robust power delivery.

Maximum Drain-Source On Resistance: 0.11 ohm

The low maximum drain-source on resistance of 0.11 ohm minimizes power losses and improves efficiency, making this power FET suitable for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the chances of connection errors, ensuring easy integration and enhancing overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) STW45NM60D attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW45NM60D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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