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STW40NF20

STMicroelectronics

STW40NF20 by STMicroelectronics

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 160 W; No. of Elements: 1; Maximum Drain-Source On Resistance: .045 ohm;

Median Price

$3.416

Lifecycle Status

EOL

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,271 parts In-Stock

1+ parts

$4.230

100+ parts

$3.170

1k+ parts

$2.730

10k+ parts

-

1,271

$4.230

$3.170

$2.730

-

DigiKey

USA . 95 parts In-Stock

1+ parts

$5.140

100+ parts

$2.879

1k+ parts

-

10k+ parts

-

95

$5.140

$2.879

-

-

Verical

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$2.602

1k+ parts

$2.356

10k+ parts

$2.356

210

-

$2.602

$2.356

$2.356

Chip1Stop

Japan . 210 parts In-Stock

1+ parts

-

100+ parts

$2.510

1k+ parts

$1.810

10k+ parts

-

210

-

$2.510

$1.810

-

EBV Elektronik

Germany . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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150

-

-

-

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Distributors (In-Stock)

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Vyrian

USA . 3,932 parts In-Stock

1+ parts

$2.510

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

$2.510

-

-

-

TME

Poland . 58 parts In-Stock

1+ parts

$2.540

100+ parts

$1.810

1k+ parts

-

10k+ parts

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58

$2.540

$1.810

-

-

Digiode

USA . 2,416 parts In-Stock

1+ parts

$3.866

100+ parts

-

1k+ parts

-

10k+ parts

-

2,416

$3.866

-

-

-

Flip Electronics

USA . 240 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$4.980

-

-

-

Chip Stock

USA . 3,900 parts In-Stock

1+ parts

-

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-

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3,900

-

-

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Anansix

USA . 2,020 parts In-Stock

1+ parts

-

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2,020

-

-

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Cyclops Electronics Ltd

UK . 990 parts In-Stock

1+ parts

-

100+ parts

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990

-

-

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RLX Solution Inc.

Canada . 600 parts In-Stock

1+ parts

-

100+ parts

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600

-

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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-

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Bristol Electronics

USA . 27 parts In-Stock

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27

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.090

100+ parts

$0.992

1k+ parts

$0.894

10k+ parts

-

5,000

$1.090

$0.992

$0.894

-

IDEA Electronic Components Group

UK . 1,741 parts In-Stock

1+ parts

$1.808

100+ parts

-

1k+ parts

$1.627

10k+ parts

-

1,741

$1.808

-

$1.627

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Ampacity Inc.

Singapore . 282 parts In-Stock

1+ parts

$2.130

100+ parts

-

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282

$2.130

-

-

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MKK Technologies

India . 1,559 parts In-Stock

1+ parts

$3.399

100+ parts

-

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10k+ parts

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1,559

$3.399

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DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$3.399

100+ parts

-

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1,559

$3.399

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Corphita

USA . 4,520 parts In-Stock

1+ parts

$3.663

100+ parts

-

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4,520

$3.663

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Microchip USA

USA . 424 parts In-Stock

1+ parts

$27.495

100+ parts

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424

$27.495

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Kepictronics

USA . 19,140 parts In-Stock

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19,140

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Alle Elektronik GmbH

Germany . 4,634 parts In-Stock

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4,634

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

-

-

-

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Parana Technologies

USA . 1,894 parts In-Stock

1+ parts

-

100+ parts

$2.162

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1,894

-

$2.162

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Perfect Parts

USA . 1,413 parts In-Stock

1+ parts

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1,413

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Epart123

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

$4.750

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1,200

-

$4.750

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GreenTree Electronics

Israel . 1,200 parts In-Stock

1+ parts

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1,200

-

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

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500

-

-

-

-

Technical Specifications

Power Field Effect Transistors (FET) STW40NF20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW40NF20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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