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STW28NK60Z

STMicroelectronics

STW28NK60Z by STMicroelectronics

STW28NK60Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 27A max drain current, and 350W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,775 parts In-Stock

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5,775

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Digiode

USA . 4,867 parts In-Stock

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4,867

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Anansix

USA . 2,845 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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IDEA Electronic Components Group

UK . 1,968 parts In-Stock

1+ parts

$0.508

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-

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$0.457

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1,968

$0.508

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$0.457

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MKK Technologies

India . 1,723 parts In-Stock

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$0.955

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1,723

$0.955

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DigiPath Technology Company

USA . 1,723 parts In-Stock

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$0.955

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$0.955

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AZTECH Wire

Italy . 493 parts In-Stock

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$19.280

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493

$19.280

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,640 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,777 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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Parana Technologies

USA . 1,164 parts In-Stock

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$0.607

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Overview

Unlock the power of efficiency with the STW28NK60Z from STMicroelectronics—your go-to solution for reliable switching in high-performance applications. Renowned for its quality and innovation, STMicroelectronics ensures exceptional durability and unparalleled performance. Designed for versatility, this N-channel FET excels in demanding environments, delivering robust energy management and reduced heat generation. Elevate your projects with cutting-edge technology that embodies value and dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making this FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance in terms of efficiency and switching speed, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration minimizes the number of components required, simplifying circuit design and enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast response and efficient power management.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures that this FET can safely handle high-voltage applications, making it suitable for industrial use.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robust mechanical support and excellent electrical connections, ensuring reliability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption and aids in efficient switching, beneficial for portable and power-sensitive applications.

Maximum Pulsed Drain Current (IDM): 108 A

The ability to handle high pulsed currents makes this FET effective for applications requiring brief surges of power.

Avalanche Energy Rating (EAS): 500 mJ

A high avalanche energy rating indicates greater resilience against voltage spikes, thus enhancing the reliability of the device.

Maximum Drain Current (Abs) (ID): 27 A

Capable of carrying a substantial current, this FET is suitable for high-power applications while maintaining efficiency.

No. of Terminals: 3

With three terminals, this FET provides a straightforward connection setup that simplifies circuit design.

Maximum Power Dissipation (Abs): 350 W

A high power dissipation rating allows the FET to manage larger amounts of heat, essential for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers added stability and ease of mounting, ensuring effective thermal management in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology contributes to lower gate drive power and faster switching speeds, beneficial for energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high operating temperature rating indicates robustness, making it suitable for diverse and demanding environmental conditions.

Transistor Element Material: SILICON

Silicon materials are widely used in electronics due to good thermal and electrical properties, ensuring reliability.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance, making it suitable for long-lasting connections.

Maximum Drain Current (ID): 27 A

This specification confirms the FET's suitability for high-current applications, enhancing its versatility and reliability.

Maximum Drain-Source On Resistance: 0.185 ohm

A low on-resistance value minimizes power loss during operation, resulting in improved efficiency and thermal performance.

Terminal Position: SINGLE

Having a single terminal position simplifies layout and design considerations, which can lead to cost-effective solutions.

Technical Specifications

Power Field Effect Transistors (FET) STW28NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW28NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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