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STW25N95K3

STMicroelectronics

STW25N95K3 by STMicroelectronics

STW25N95K3 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 950V breakdown voltage and 22A max drain current. It offers a built-in diode and operates in enhancement mode. With a robust design, it supports high power dissipation up to 400W.

Median Price

$33.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 7 parts In-Stock

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$33.080

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 5,643 parts In-Stock

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Digiode

USA . 1,494 parts In-Stock

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Anansix

USA . 270 parts In-Stock

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270

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Bristol Electronics

USA . 18 parts In-Stock

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Dan-Mar Components

USA . 18 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$1.210

100+ parts

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$1.089

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$1.210

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$1.089

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MKK Technologies

India . 437 parts In-Stock

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$2.275

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$2.275

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DigiPath Technology Company

USA . 437 parts In-Stock

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$2.275

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437

$2.275

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AZTECH Wire

Italy . 138 parts In-Stock

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$10.360

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$10.360

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Component Stockers USA

USA . 519 parts In-Stock

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$99.990

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519

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,296 parts In-Stock

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Perfect Parts

USA . 3,739 parts In-Stock

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Parana Technologies

USA . 1,174 parts In-Stock

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$1.446

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Kepictronics

USA . 1,000 parts In-Stock

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Corphita

USA . 504 parts In-Stock

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Overview

Elevate your power management solutions with the STW25N95K3 from STMicroelectronics, a leader in innovative semiconductor technology. This high-performance N-channel FET is designed for robust switching applications, ensuring efficiency and reliability. With its impressive breakdown voltage and built-in diode, you gain enhanced safety and performance in demanding environments. Trust in STMicroelectronics for quality that drives your projects forward, delivering value and superior energy management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are widely used for their higher efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies design and can prevent issues related to reverse polarity, enhancing reliability in circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers rapid operation, making it ideal for high-speed switching tasks.

Minimum DS Breakdown Voltage: 950 V

With a high breakdown voltage, this FET is suitable for high-voltage applications, reducing the risk of breakdown during operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, facilitating compact design layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, ensuring reliable connections in circuit assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the conduction state, making this FET efficient for various applications.

Maximum Pulsed Drain Current (IDM): 88 A

The capacity for high pulsed drain current enables this FET to handle demanding transient loads, making it suitable for power applications.

Avalanche Energy Rating (EAS): 450 mJ

A high avalanche energy rating indicates robust performance under fault conditions, enhancing safety and reliability.

Maximum Drain Current (Abs) (ID): 22 A

With a maximum drain current of 22 A, this FET supports heavy load applications, making it versatile for different designs.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design while enabling effective control and functionality.

Maximum Power Dissipation (Abs): 400 W

High power dissipation capability allows for operation in demanding environments without overheating, enhancing system reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging facilitates better thermal performance and mechanical strength, essential for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high speed and high efficiency, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows for reliable performance in demanding environments without degradation.

Transistor Element Material: SILICON

Silicon construction provides a good balance of performance and cost, widely used in power applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 22 A

Reiterating its capability to handle significant currents, this feature underscores its versatility in different applications.

Maximum Drain-Source On Resistance: 0.36 ohm

Low on-resistance is crucial for minimizing power loss during operation, improving efficiency and reducing heat generation.

Terminal Position: SINGLE

A single terminal position ensures simplified PCB layout and design without compromising connectivity.

Technical Specifications

Power Field Effect Transistors (FET) STW25N95K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

450 mJ

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW25N95K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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