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STV6411A

STMicroelectronics

STV6411A by STMicroelectronics

STV6411A by STMicroelectronics is a BICMOS multiplexer with a 64-terminal flatpack design, suitable for surface mounting. It operates b/w 0 °C and 70 °C and supports power supplies of 8V to 12V. Ideal for commercial applications requiring efficient signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,584 parts In-Stock

1+ parts

-

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4,584

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-

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Digiode

USA . 1,254 parts In-Stock

1+ parts

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-

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1,254

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ACDS - Activité Composants Distribution Service

France . 612 parts In-Stock

1+ parts

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612

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Anansix

USA . 385 parts In-Stock

1+ parts

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385

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$6.724

100+ parts

-

1k+ parts

$6.052

10k+ parts

-

449

$6.724

-

$6.052

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MKK Technologies

India . 1,961 parts In-Stock

1+ parts

$12.645

100+ parts

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1,961

$12.645

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DigiPath Technology Company

USA . 1,961 parts In-Stock

1+ parts

$12.645

100+ parts

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1,961

$12.645

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-

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Authorized Procurement Solutions

USA . 47,900 parts In-Stock

1+ parts

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47,900

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GreenTree Electronics

Israel . 1,760 parts In-Stock

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1,760

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Perfect Parts

USA . 1,371 parts In-Stock

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1,371

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Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

$8.040

1k+ parts

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1,212

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$8.040

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Corphita

USA . 964 parts In-Stock

1+ parts

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964

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Cyclops Electronics Ltd (Excess)

UK . 612 parts In-Stock

1+ parts

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612

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Glotronic Ltd.

UK . 490 parts In-Stock

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490

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Overview

Unlock unparalleled versatility and performance with the STV6411A from STMicroelectronics! Designed for cutting-edge multiplexing and switching applications, this robust component delivers exceptional reliability in diverse environments. With its advanced BICMOS technology, it ensures seamless operation across various power supplies while optimizing system efficiency. Trust in STMicroelectronics' legacy of innovation to elevate your projects and enhance your competitive edge!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the packaging enhances durability and resistance to environmental factors, making this product reliable for varied applications.

Surface Mount: YES

Surface mount technology allows for compact designs, providing flexibility in PCB layout and enabling high-density configurations.

Package Shape: SQUARE

A square package shape optimizes space on the circuit board, allowing for efficient layout and routing of signals.

Power Supplies (V): 8,12

Dual voltage options of 8V and 12V provide versatility in power supply configurations, accommodating a range of system designs.

No. of Terminals: 64

With 64 terminals, this device supports complex and extensive connections, ideal for high-performance applications.

Package Style (Meter): FLATPACK

Flatpack style aids in efficient heat dissipation and fits seamlessly into automated assembly processes.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in warmer environments and reduces the risk of thermal failure.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C makes this component suitable for applications in moderate to cold environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability and ensures a reliable electrical connection over time.

Terminal Position: QUAD

Quad terminal positioning provides improved access and layout flexibility on the PCB, enhancing the design process.

Temperature Grade: COMMERCIAL

Being classified for commercial use guarantees adequate performance within standard environmental conditions, suitable for a majority of applications.

Technology: BICMOS

BICMOS technology combines the best of bipolar and CMOS technologies, resulting in better performance, lower power consumption, and increased functionality.

Terminal Form: GULL WING

Gull wing terminals facilitate easy assembly and better support in soldering processes, leading to improved durability.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch allows for high-density connections, making it ideal for compact electronic designs without sacrificing performance.

Technical Specifications

Multiplexers & Switches STV6411A attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

8,12

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STV6411A Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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