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STV6411AD

STMicroelectronics

STV6411AD by STMicroelectronics

STV6411AD by STMicroelectronics is a 64-terminal BICMOS multiplexer with 4 functions, operating at 8V. It features a low-profile square package suitable for audio/video switching applications. With a temperature range of 0-70 °C and nickel palladium gold finish, it offers reliable performance in commercial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,509 parts In-Stock

1+ parts

-

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3,509

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Anansix

USA . 770 parts In-Stock

1+ parts

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770

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R&J Components

USA . 319 parts In-Stock

1+ parts

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319

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Bristol Electronics

USA . 280 parts In-Stock

1+ parts

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280

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Digiode

USA . 99 parts In-Stock

1+ parts

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99

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,726 parts In-Stock

1+ parts

$12.725

100+ parts

-

1k+ parts

$11.453

10k+ parts

-

1,726

$12.725

-

$11.453

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MKK Technologies

India . 1,763 parts In-Stock

1+ parts

$23.929

100+ parts

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1,763

$23.929

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DigiPath Technology Company

USA . 1,763 parts In-Stock

1+ parts

$23.929

100+ parts

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1,763

$23.929

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Corphita

USA . 4,156 parts In-Stock

1+ parts

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4,156

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Parana Technologies

USA . 2,059 parts In-Stock

1+ parts

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100+ parts

$15.215

1k+ parts

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2,059

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$15.215

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Assy Fe

Spain . 119 parts In-Stock

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119

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Overview

Elevate your audio and video switching experience with the STV6411AD by STMicroelectronics. Crafted with precision using high-quality materials, this multiplexer offers unrivaled performance and reliability. Whether you're in need of seamless signal switching for professional AV setups or enhancing the functionality of your home entertainment system, the STV6411AD delivers exceptional value and convenience. Trust in STMicroelectronics' expertise in creating innovative solutions that elevate your audio/video experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the multiplexer or switch.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

With 4 functions in one device, this multiplexer or switch offers versatility and flexibility in usage.

Package Shape: SQUARE

The square package shape is commonly used in electronic components, making integration into designs straightforward.

Nominal Supply Voltage (Vsup): 8 V

The 8V supply voltage ensures stable and consistent operation of the multiplexer or switch.

Power Supplies (V): 8,12

Support for multiple power supply options (8V and 12V) allows for compatibility with a range of systems.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for the multiplexer or switch to interface with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style make for a compact and space-saving design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides good electrical conductivity for reliable signal transmission.

Terminal Position: QUAD

The quad terminal position allows for easy connection to external circuits.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables a compact overall design for the multiplexer or switch.

Width (mm): 10 mm

The 10mm width facilitates easy integration into circuit board layouts.

Other IC type: AUDIO/VIDEO SWITCH

This multiplexer or switch is specialized for audio and video applications, providing high-quality signal routing.

Minimum Supply Voltage (Vsup): 7.5 V

The 7.5V minimum supply voltage ensures compatibility with a variety of power sources.

Length: 10 mm

The 10mm length contributes to the compact form factor of the multiplexer or switch.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating indicates suitability for standard operating conditions.

No. of Channels: 12

With 12 channels available, this multiplexer or switch can handle multiple input/output signals simultaneously.

Technology: BICMOS

The BICMOS technology used in this product offers a balance of performance and power efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto circuit boards.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for fine-pitch mounting on circuit boards, conserving space.

Maximum Supply Voltage (Vsup): 8.5 V

The 8.5V maximum supply voltage ensures safe operation under varying voltage conditions.

Technical Specifications

Multiplexers & Switches STV6411AD attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

ASYMMETRIC INPUTS

Other IC type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Channels:

12

No. of Functions:

4

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

8,12

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

8.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

STV6411AD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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