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STV6410A

STMicroelectronics

STV6410A by STMicroelectronics

STV6410A by STMicroelectronics is a BICMOS technology multiplexer with 64 terminals, operating b/w 0-70 °C. It has power supplies of 8-12V and is surface mountable in a square package shape. Ideal for commercial applications requiring high terminal count and temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,714 parts In-Stock

1+ parts

-

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2,714

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Vyrian

USA . 2,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,647

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Anansix

USA . 1,143 parts In-Stock

1+ parts

-

100+ parts

-

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1,143

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Cyclops Electronics Ltd

UK . 454 parts In-Stock

1+ parts

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454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$17.171

100+ parts

-

1k+ parts

$15.454

10k+ parts

-

108

$17.171

-

$15.454

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MKK Technologies

India . 2,001 parts In-Stock

1+ parts

$32.289

100+ parts

-

1k+ parts

-

10k+ parts

-

2,001

$32.289

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-

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DigiPath Technology Company

USA . 2,001 parts In-Stock

1+ parts

$32.289

100+ parts

-

1k+ parts

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10k+ parts

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2,001

$32.289

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-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

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-

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Corphita

USA . 3,023 parts In-Stock

1+ parts

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3,023

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Kepictronics

USA . 960 parts In-Stock

1+ parts

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960

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Parana Technologies

USA . 515 parts In-Stock

1+ parts

-

100+ parts

$20.530

1k+ parts

-

10k+ parts

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515

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$20.530

-

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Overview

Upgrade your electronic projects with the STV6410A from STMicroelectronics, a high-quality multiplexer and switch that offers unmatched performance and reliability. With its innovative technology and commercial-grade temperature range, this versatile component is perfect for a wide range of applications. Whether you're working on consumer electronics, industrial automation, or telecommunications systems, the STV6410A provides the value, benefits, and advantages you need to take your designs to the next level. Trust in STMicroelectronics for superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or high-durability applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board, enabling compact designs and maximizing the number of components that can be integrated.

Power Supplies (V): 8, 12

Support for multiple power supply voltages (8V and 12V) provides flexibility in system design and compatibility with various power sources.

No. of Terminals: 64

With a high number of terminals, the product can accommodate complex signal routing and connectivity requirements, making it suitable for advanced multiplexing and switching applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, suitable for space-constrained environments and applications where height restrictions are a concern.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70 °C ensures reliability and performance under normal operating conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the product can work effectively in various temperature environments without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures stable electrical connections, contributing to the reliability and longevity of the product.

Terminal Position: QUAD

The quad terminal position offers improved stability and alignment during installation, reducing the risk of misalignment or connection issues.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades indicates that the product is suitable for standard operating conditions in commercial and industrial environments.

Technology: BICMOS

Utilizing BiCMOS technology allows for high-speed switching capabilities and low power consumption, making the product efficient and suitable for various high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and rework processes, enhancing the product's ease of use and serviceability.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, the product enables high-density packaging and precise signal routing, making it ideal for applications requiring compact designs and fine-pitch components.

Technical Specifications

Multiplexers & Switches STV6410A attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

8,12

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STV6410A Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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